This video presents the capabilities of BEST Inc in terms of its ability to perform high end PCB rework and repair services. BEST Inc., located in Rolling Meadows IL is a company of soldering "geeks". We rework/repair PCBs, train and certify solderin
Industry News | 2012-01-13 13:20:53.0
Zymet has introduced a new reworkable underfill encapsulant, CN-1736, designed to underfill 0.4-mm pitch Package-on-Package (POP) assemblies. It has low viscosity and a lower CTE than its predecessors. Plus it has greater flux compatibility, making it suitable for use with a broader range of solderpastes and tacky fluxes.
Technical Library | 2023-07-25 16:50:02.0
Some of the new handheld communication devices offer real challenges to the paste printing process. Normally, there are very small devices like 01005 chip components as well as 0.3 mm pitch uBGA along with other devices that require higher deposits of solder paste. Surface mount connectors or RF shields with coplanarity issues fall into this category. Aperture sizes for the small devices require a stencil thickness in the 50 to 75 um (2-3 mils) range for effective paste transfer whereas the RF shield and SMT connector would like at least 150 um (6 mils) paste height. Spacing is too small to use normal step stencils. This paper will explore a different type of step stencil for this application; a "Two-Print Stencil Process" step stencil. Here is a brief description of a "Two-Print Stencil Process". A 50 to 75 um (2-3 mils) stencil is used to print solder paste for the 01005, 0.3 mm pitch uBGA and other fine pitch components. While this paste is still wet a second in-line stencil printer is used to print all other components using a second thicker stencil. This second stencil has relief pockets on the contact side of the stencil any paste was printed with the first stencil. Design guidelines for minimum keep-out distances between the relief step, the fine pitch apertures, and the RF Shields apertures as well relief pocket height clearance of the paste printed by the first print stencil will be provided.
Industry Directory | Manufacturer
Founded in 1978, Asemco was established to provide manufacturing solutions to companies looking for a level of personalized service, quality and agility that is not available from larger EMS providers
Industry Directory | Consultant / Service Provider / Manufacturer
Specializing in electronic circuit board assembly services. Various capabilities include engineering, assembly, designing, prototyping,supply chain management, testing, documentation, rework, repair and soldering. On-time delivery
High accuracy, high flexibility for 0201 (0.6mm x 0.3mm),SOIC,PLCC,BGA,,CSP,QFP (0.3mm pitch). Smart feeder ID system provide fast set up and easy programming. Suitable for small & medium volume production. Vision On the Fly Alignment system. Bot
Parts & Supplies | Chipshooters / Chip Mounters
Samsung SM481 Chip Mounter Focus on the way flight vision + fixed vision (optional) Number of axes 10 axes * 1 gantry Mounting Speed 0603 39000 (Best Conditions) Mounting accuracy chip ± 50um @ 3ó / chip, QFP ± 30um @ 3ó / chip Component Ra
New Equipment | Assembly Services
The board is designed by customer and it's for Mobile Phone. We did one-Stop EMS Service for this project (PCB manufacture, components sourcing, SMT and THT assembly): Product name: 6 Layer PCBA board Material: FR-4 TG180, Shengyi Thicknss: 1.0mm Su
New Equipment | Assembly Services
The board is designed by customer and it's for Air Purification control PCBA board. We did one-Stop EMS Service for this project (PCB manufacture, components sourcing, SMT and THT assembly): Product name: 2 Layer PCBA board Material: FR-4 Thicknss:
New Equipment | Assembly Services
The board is designed by customer and it's for Power Bank PCBA board. We did one-Stop EMS Service for this project (PCB manufacture, components sourcing, SMT and THT assembly): Product name: 2 Layer PCBA board Material: FR-4 Thicknss: 1.6mm Surface:
winsouce.jpg)
