Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Used SMT Equipment | Pick and Place/Feeders
Heads: 1 rotary head on X/Y gantry with 8 pick ups & a 40 position ‘smart’ nozzle bank Rate: 9 100 cph (IPC: 7 750 cph) Components: 0201 to 50x50mm Pitch: 0.3mm (QFP), 0.4mm (µBGA) Accuracy: 40µm (QFP’s) @ 3 sigma 75µm (Chips) @ 3 sigma (
Used SMT Equipment | Pick and Place/Feeders
The Dymexion has been clearly targeted for a well described part of the market namely: - Affordable placement solutions for medium level, prototyping and medium to large but flexible production runs - And an economical placement system for flexible
Parts & Supplies | Circuit Board Assembly Products
1). 177 x 75mm (2UP), FR-4 Tg 170 2). 1.6mm +/-10%, 6 layer 3). Min. hole 0.15mm, 4/4 track/gap 4). Finished copper weight inner/outer 1 oz 5). Green solder mask/ White ident 6). Immerstion gold. 7). Fine and micro BGA
AUTOTRONIK-SMT is a German company provides High Precision SMT Pick & Place Machine, Stencil Printer,Reflow Oven. which are low-cost, high accuracy ,with Laser & Vision alignment, can handle 0201,0402,SOIC,PLCC,Micro-BGA,0.3mm QFP,..etc.
Used SMT Equipment | Pick and Place/Feeders
Quad Pick & Place Model: QSX-1 Serial Number: 3376 Quad QSX-1 Pick and Place System Features: Dual gantry design provides placement rates up to 7,000 cph takt time Handles board sizes from 3.2" x 3" to 19.3" x 25" In-process QuadAlign touch
Technical Library | 2023-07-25 16:42:54.0
Printing solder paste for very small components like .3mm pitch CSP's and 01005 Chip Components is a challenge for the printing process when other larger components like RF shields, SMT Connectors, and large chip or resistor components are also present on the PCB. The smaller components require a stencil thickness typically of 3 mils (75u) to keep the Area Ratio greater than .55 for good paste transfer efficiency. The larger components require either more solder paste height or volume, thus a stencil thickness in the range of 4 to 5 mils (100 to 125u). This paper will explore two stencil solutions to solve this dilemma. The first is a "Two Print Stencil" option where the small component apertures are printed with a thin stencil and the larger components with a thicker stencil with relief pockets for the first print. Successful prints with Keep-Outs as small as 15 mils (400u) will be demonstrated. The second solution is a stencil technology that will provide good paste transfer efficiency for Area Ratio's below .5. In this case a thicker stencil can be utilized to print all components. Paste transfer results for several different stencil types including Laser-Cut Fine Grain stainless steel, Laser-Cut stainless steel with and w/o PTFE Teflon coating, AMTX E-FAB with and w/o PTFE coating for Area Ratios ranging from .4 up to .69.
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Industry Directory | Distributor
Representing Foreign Principals for their range of SMT / PCB Assembly equipments.
Industry News | 2012-01-17 11:05:35.0
Practical Components introduces a test board for its dummy (mechanical sample) version of Amkor’s cutting-edge 0.3 mm pitch CVBGA. Amkor’s new semiconductor device is a wafer-scale package in a miniature package, which is suitable for installation in surface mount technology (SMT). Amkor’s ChipArray® range of packages consists of laminate-based ball grid array (BGA) packages that are compatible with established SMT mounting processes.
