Full Site - : bga pitch .3mm (Page 10 of 157)

Fuji feeder AMCA-7200

Fuji feeder AMCA-7200

Parts & Supplies | Pick and Place/Feeders

FUJI feeders have a wide size selection, along with several options for paper and pitch. FUJI provides paper feeder in sizes ranging from 8mm to 72mm. In addition to the paper feeders, FUJI offers a wide variety of embossed feeders to meet your paper

KingFei SMT Tech

Reballing Preforms Now in 3 Days

Industry News | 2013-09-03 11:52:21.0

BEST's EZReball(TM) reballing preforms now are available as standard in 3 business days. Expedited packs are in available in 24 hours to help you with your reballing projects

BEST Inc.

BGA Reballing Services

BGA Reballing Services

Videos

EZReball demonstration video. Simple and Fast new reball method! The new BEST EZReball™ process is an answer to your reballing problems. This unique method simplifies the reballing process allowing for better yields and faster reballing times. http:

BEST Inc.

BGA Rework. A Comparative Study of Selective Solder Paste Deposition For Area Array Packages

Technical Library | 2007-02-01 09:57:15.0

The rapid assimilation of Ball Grid Array (BGA) and other Area Array Package technology in the electronics industry is due to the fact that this package type allows for a greater I/O count in a smaller area while maintaining a pitch that allows for ease of manufacture.

BEST Inc.

BGA X-Ray Inspection

BGA X-Ray Inspection

Videos

BEST's BGA x-ray inspection capabilities are shown as one of the x-ray techs "drives around" the BGA after BGA rework. During BGA x-ray inspection the first view is a macro one followed by zooming in and examing each area closely. Look at our BGA X-

BEST Inc.

BGA Rework Service

BGA Rework Service

Videos

This video describes the BEST BGA rework and BGA rework services capabilities. What is described in this movie are the people, processes and tools unique to BEST and how that impacts its customers. The advanced equipment set including multiple refl

BEST Inc.

Selective Solder Paste Deposition Reliability Test Results.

Technical Library | 2007-06-21 17:03:16.0

The rapid assimilation of Ball Grid Array (BGA) and other Area Array Package technology in the electronics industry is due to the fact that this package type allows for a greater I/O count in a smaller area while maintaining a pitch that allows for ease of manufacture (...) While there have been several studies comparing these two attachment methods, this study highlights the effect of rework technique on the electrical characteristics and reliability of reworked BGAs.

BEST Inc.

Reballing Preforms-EZReball™

Reballing Preforms-EZReball™

New Equipment | Rework & Repair Equipment

The BEST EZReball™ process is the answer to your reballing problems. This BGA reballing process simplifies the process while eliminating the clean up of all those paper remnants, allowing for better yields and faster reballing times. The simplicity o

BEST Inc.

BEST, Inc. Will Be Conducting 2 Training Sessions at the IPC APEX Expo 2016

Industry News | 2016-02-27 20:41:52.0

BEST Inc. instructors will be conducting 2 training sessions this year at the APEX Expo 2016 - Advanced Rework: Hands-on BGA Reballing, Lead-Free Devices, and Fine-Pitch Parts, and the 2nd session - Stencil Printing: Consistent Print Volumes for SMT Rework.

BEST Inc.

This video describes the J-STD-001 solder certification program. It is an overview of the program, the certification requirements and the types of credentials.

This video describes the J-STD-001 solder certification program. It is an overview of the program, the certification requirements and the types of credentials.

Videos

This video describes the J-STD-001 solder certification program. It is an overview of the program, the certification requirements and the types of credentials. For More Information On IPC J-STD-001 Training Visit Our Website: IPC J-STD-001 CIT Cert

BEST Inc.


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