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SMT Assembly & Inspection Services

SMT Assembly & Inspection Services

New Equipment | Assembly Services

Qualitel is equipped and staffed to provide a wide array of assembly capabilities ranging from highly automated to purely manual.  We constantly add new capabilities to support customer requirements.  Most of our  manufacturing employees are certifie

Qualitel Corporation

DRM-18H Component Identification Training and Reference Guide

DRM-18H Component Identification Training and Reference Guide

New Equipment | Education/Training

The Component Identification Training & Reference Guide is a valuable tool for employee training and quick reference. This comprehensive component identification resource for electronics assembly operators and inspectors contains color photographs, c

soldertools.net

New Underfill from Zymet for 0.4-mm pitch POP's

Industry News | 2012-01-13 13:20:53.0

Zymet has introduced a new reworkable underfill encapsulant, CN-1736, designed to underfill 0.4-mm pitch Package-on-Package (POP) assemblies. It has low viscosity and a lower CTE than its predecessors. Plus it has greater flux compatibility, making it suitable for use with a broader range of solderpastes and tacky fluxes.

Zymet, Inc

Solder Joint Encapsulant for Ball Bumping Applications: BP 256

Industry News | 2014-09-22 10:40:15.0

YINCAE Advanced Materials, LLC is pleased to announce the release and availability of BP 256. It is a part of the innovative SMT 256/266 series, solder joint encapsulant.

YINCAE Advanced Materials, LLC.

Solder Joint Encapsulant

Industry News | 2015-05-13 14:00:03.0

The evolution of soldering processes in the Microelectronics Industry has made a paradigm shift away from Sn/ Pb to Pb-free. Compounded with advancements in miniaturization, Pb- free soldering's higher re-flow temperature and the nature of solder has resulted in poor reliability relative to: mechanical strength of the solder joint, warpage and thermal cycling performance. In response, YINCAE engineered low temperature solder joint encapsulation adhesives.

YINCAE Advanced Materials, LLC.

ECTC is 1 Month Away Visit YINCAE Booth 506

Industry News | 2016-04-27 16:18:18.0

ECTC is only 1 month away! The tradeshow will take place at The Cosmopolitan hotel in Las Vegas, NV from May 31st to June 3rd. YINCAE hopes that you will stop by our Booth 506 to learn more about YINCAE and the innovative products we have to offer.

YINCAE Advanced Materials, LLC.

YINCAE at ECTC in Las Vegas in 2 weeks!!

Industry News | 2016-05-18 09:46:48.0

ECTC is 2 weeks away! The tradeshow will take place at The Cosmopolitan hotel in Las Vegas, NV, June 1st and 2nd. YINCAE hopes you will stop by our Booth 506 to learn more about YINCAE and the innovative products we have to offer.

YINCAE Advanced Materials, LLC.


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High Throughput Reflow Oven

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We offer SMT Nozzles, feeders and spare parts globally. Find out more
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Training online, at your facility, or at one of our worldwide training centers"