New Equipment | Assembly Services
Qualitel is equipped and staffed to provide a wide array of assembly capabilities ranging from highly automated to purely manual. We constantly add new capabilities to support customer requirements. Most of our manufacturing employees are certifie
New Equipment | Education/Training
The Component Identification Training & Reference Guide is a valuable tool for employee training and quick reference. This comprehensive component identification resource for electronics assembly operators and inspectors contains color photographs, c
Industry News | 2017-01-24 10:55:12.0
BP 256 is YINCAE’s new ball attach adhesive product
Industry News | 2010-09-16 21:44:04.0
The Balver Zinn Group announces that Cobar Europe BV now distributes Yincae Advanced Materials’ SMT 158 Capillary Underfill and SMT 256 Individual Solder Joint Encapsulations throughout Europe.
Industry News | 2015-09-03 15:28:17.0
Metcal today announced that its new series of cutting-edge rework and repair workshops will resume in September 2015. The workshops will address the latest techniques for contactless site cleaning and rework as well as repair of a variety of applications.
Industry News | 2015-11-04 20:17:41.0
Metcal today announced the dates for the final two workshops of the Cutting Edge Rework Tour. The workshops will address the latest techniques for contactless site cleaning and rework as well as repair of a variety of applications.
Industry News | 2016-02-02 10:03:59.0
Metcal today announced that it will hold the first workshop of the 2016 Cutting Edge Rework Tour on Thursday, March 3, 2016 at the Hilton Melbourne Rialto Place in Melbourne, FL. The workshop will address the latest techniques for contactless site cleaning and rework as well as repair of a variety of applications.
Industry News | 2012-01-13 13:20:53.0
Zymet has introduced a new reworkable underfill encapsulant, CN-1736, designed to underfill 0.4-mm pitch Package-on-Package (POP) assemblies. It has low viscosity and a lower CTE than its predecessors. Plus it has greater flux compatibility, making it suitable for use with a broader range of solderpastes and tacky fluxes.
Industry News | 2009-03-10 15:56:35.0
San Diego � January 2009 � KIC, the leader of thermal process development and control products, and winner of multiple industry awards, announces that it will introduce Reflow Process Inspection (RPI) in booth 2258 at the APEX 2009 exhibition and conference, scheduled to take place March 31-April 2, 2009 in Las Vegas.
Industry News | 2009-04-08 19:05:40.0
San Diego � March 2009 � KIC announces that it has been awarded a NPI Award in the category of Process Control Tools for its RPI in-line inspection system. The award was presented to the company during a Monday, March 30, 2009 ceremony that took place in the Mandalay Bay Resort & Convention Center in Las Vegas before the start of APEX 2009.
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