Technical Library | 2013-12-27 10:39:21.0
The head-in-pillow defect has become a relatively common failure mode in the industry since the implementation of Pb-free technologies, generating much concern. A head-in-pillow defect is the incomplete wetting of the entire solder joint of a Ball-Grid Array (BGA), Chip-Scale Package (CSP), or even a Package-On-Package (PoP) and is characterized as a process anomaly, where the solder paste and BGA ball both reflow but do not coalesce. When looking at a cross-section, it actually looks like a head has pressed into a soft pillow. There are two main sources of head-in-pillow defects: poor wetting and PWB or package warpage. Poor wetting can result from a variety of sources, such as solder ball oxidation, an inappropriate thermal reflow profile or poor fluxing action. This paper addresses the three sources or contributing issues (supply, process & material) of the head-in-pillow defects. It will thoroughly review these three issues and how they relate to result in head-in pillow defects. In addition, a head-in-pillow elimination plan will be presented with real life examples will be to illustrate these head-in-pillow solutions.
Industry News | 2013-01-24 07:34:04.0
VJ Electronix, Inc announces the installation of a new 400ST Automated Scavenger System into BEST’s Rolling Meadows, IL facility.
Industry News | 2019-07-15 14:35:27.0
(Albany, NY) July 15, 2019 YINCAE Advanced Materials is proud to announce that we will be exhibiting at this year’s IMAPS 2019 Boston 52nd International Symposium on Microelectronics, at the Hynes Convention Center, in Boston, MA on October 1 - 2, 2019.
Industry News | 2009-03-17 06:02:48.0
March 2009 � VJ Electronix, Inc., the leader in rework technologies and global provider of advanced X-ray inspection systems, announces that it will showcase the Summit 1800 advanced rework system in booth 2265 at the upcoming 2009 APEX Electronics Manufacturing Exhibition and Conference, scheduled to take place Tuesday, March 31 through Thursday, April 2, 2009, at the Mandalay Bay Hotel & Convention Center in Las Vegas, Nevada, USA.
Bob Willis videos show you How to Do It each month. This month we talk about adhesion testing like copper foil, plated copper on PCBs or conformal coating adhesion to board assemblies. Adhesion testing can be used for many different materials and in
Industry News | 2012-02-17 14:25:10.0
Nordson DAGE will co-sponsor and participate in a Webinar titled “Package on Package (PoP) Assembly Process & Inspection” on Thursday March 15, 2012 from 2:30-3:30 p.m. GMT. Keith Bryant, Nordson DAGE’s Global Sales Director and SMART Group’s Chairman, will present industry-leading information about PoP inspection during the Webinar.
Industry News | 2013-01-18 16:47:20.0
AIM Solder announces that its VP of Technology Karl Seelig will present his paper titled “Conformal Coating Over No-Clean Flux” at the upcoming IPC APEX Expo
Industry News | 2015-03-17 11:57:01.0
At the upcoming 2015 Nepcon Shanghai show Viscom AG, leading manufacturer of highly precise and efficient inspection systems for the electronics industry, will showcase its latest innovations, demonstrating the highlights of its most advanced and comprehensive range of 3D- AOI, SPI and X-ray inspection systems.
Industry News | 2015-04-15 19:00:42.0
Rocket EMS today announced it has further enhanced its already impressive rework and special project capabilities with the purchase of the AIR-VAC DRS27 Large Format BGA Rework Station. The DRS27 provides Rocket EMS with unparalleled precision and flexibility for rework and assembly of BGAs, QFNs, CSPs, flip chips, PoP assemblies, 01005s and more.
Industry News | 2016-08-19 05:00:52.0
If you have a process problem, let NPL Defect of the Month Video help you team
