Industry News | 2014-02-17 20:20:58.0
IC today announced that it will showcase the affordable and easy-to-use ProBot automatic profiling system in Booth #1336 at the IPC APEX Expo, scheduled to take place March 25-27, 2014 at the Mandalay Bay Resort & Convention Center in Las Vegas, Nevada.
Industry News | 2014-08-25 16:44:25.0
KIC will showcase the affordable and easy-to-use ProBot automatic profiling system and K2 new generation profile setter in Booth #439 at SMTA International. KIC will be co-located with Heller at the two-day exhibition.
Industry News | 2008-01-16 14:12:28.0
LOS ALAMITOS, CA � January 15, 2008 � Practical Components, a leading international distributor of mechanical IC samples or �dummy� components and SMD production tools and equipment, announces that it will showcase its latest technology at the 2008 INTERNEPCON JAPAN exhibition to take place January 16-18 at the Tokyo Big Sight, Tokyo Japan. Practical will be displaying their products in booth No 14-14 with their Japanese Distributor, NISSHO MUSEN CO., LTD.
Industry News | 2008-03-04 12:17:22.0
LOS ALAMITOS, CA � January 2008 � Practical Components, a leading international distributor of mechanical IC samples or �dummy� components and SMD production tools and equipment, announces that it will showcase its latest technology at the 2008 APEX exhibition and conference that will take place April 1-3, 2008 at the Mandalay Bay Resort and Convention Center, Las Vegas, Nevada. Practical will display its products in booth 2719.
Industry News | 2008-03-12 16:54:18.0
LOS ALAMITOS, CA � March 2008 � Practical Components, a leading international distributor of mechanical IC samples or �dummy� components and SMD production tools and equipment, announces that it will showcase its latest technology at the 2008 APEX exhibition and conference that will take place April 1-3, 2008 at the Mandalay Bay Resort and Convention Center, Las Vegas, Nevada. Practical will display its products in booth 2719.
Industry News | 2023-04-18 10:15:50.0
Unicomp Technology Showcases Cutting-Edge Electronic Inspection Equipment at Shanghai Productronica Exhibition
Industry News | 2013-09-16 14:19:30.0
Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN) is delighted to announce that Evstatin Krastev, Ph.D., partnered with Zhen (Jane) Feng, Ph. D., Tho Vu, Michael Xie, David A. Geiger and Murad Kurwa of FLEXTRONICS International Inc., and Zohair Mehkri of Santa Clara University, will be presenting their paper titled, “2D/3D X-Ray Inspection: Process Control and Development Tool” during technical session PRC2 Imaging, Inspection and Quality at the upcoming SMTA International in Fort Worth Texas.
Technical Library | 2013-12-27 10:39:21.0
The head-in-pillow defect has become a relatively common failure mode in the industry since the implementation of Pb-free technologies, generating much concern. A head-in-pillow defect is the incomplete wetting of the entire solder joint of a Ball-Grid Array (BGA), Chip-Scale Package (CSP), or even a Package-On-Package (PoP) and is characterized as a process anomaly, where the solder paste and BGA ball both reflow but do not coalesce. When looking at a cross-section, it actually looks like a head has pressed into a soft pillow. There are two main sources of head-in-pillow defects: poor wetting and PWB or package warpage. Poor wetting can result from a variety of sources, such as solder ball oxidation, an inappropriate thermal reflow profile or poor fluxing action. This paper addresses the three sources or contributing issues (supply, process & material) of the head-in-pillow defects. It will thoroughly review these three issues and how they relate to result in head-in pillow defects. In addition, a head-in-pillow elimination plan will be presented with real life examples will be to illustrate these head-in-pillow solutions.
New Equipment | Solder Materials
Indium Corporation manufactures high quality solder powders and pastes. Powders are available in hundreds of alloys and a full range of sizes. Solder pastes can be made from these powders using a wide variety of flux vehicles to get the best fit for
New Equipment | Solder Materials
Alpha® offers a full line of technologically advanced solder pastes developed to provide high throughput and yield, and lowest cost of ownership for a wide range of applications. Our offering includes leading lead-free, no-clean, halogen-free solder
