Electronics Forum | Thu Feb 07 08:08:20 EST 2008 | scottp
We also use machinists dye. I like to pull a vacuum on the board after wicking the dye under the BGA. It seems to help fill fine cracks. I'll stick it in a warm oven if I'm in a hurry for the dye to dry. Then just bend the board to pop off the BGA.
Electronics Forum | Thu Jul 06 13:36:37 EDT 2006 | SWAG
We've had much trouble with flex circuits. As previously mentioned, you must have local fids for the board or the BGA itself (if panelized). Other troubles we experience are drilled holes for pinned connectors. Unless the PCB manufactur has some w
Electronics Forum | Wed Jul 04 12:18:14 EDT 2012 | davef
Phil is correct in his description of proper rework technique. Possible explanations of the reason for popping of your BGA are: * Thermal cycling of components cause them to flex on a different point in the cycle that the board possibly resulting in
Electronics Forum | Tue Feb 03 14:19:29 EST 2009 | grics
I would agree if you have a board to setup the process. But sometimes this doesn't work... If for some reason if the customers AVL has a Lead Free BGA and I am running Leaded paste (yes this really happens!), you will need to run hotter to get your
Electronics Forum | Wed Feb 10 18:17:46 EST 1999 | Earl Moon
| Hi, | | Has anyone found any significant differences on profiling using populated and unpopulated boards? Is it worth sacrificing a board to the profile gods? | | Joe | What's the cost of not doing it. In the same breath, why not wait for a sc
Electronics Forum | Thu Oct 01 07:03:55 EDT 2009 | davef
We doubt that Humiseal 1A33 is causing opens in your assemblies. We'd guess the opens occur earlier in the process, but are not hard failures. So, you pass your tests. When applied, the conformal coat flows into the gap in the ball crack and insulate
Electronics Forum | Thu Jan 31 07:49:38 EST 2008 | cyber_wolf
"What do I Really Need" is a subjective question.It all depends on who you ask. I have been in small mom and pop shops that were running BGA's and they were doing some scary stuff.(I wont go into details) In order to put a correct process together y
Electronics Forum | Fri Jan 09 04:37:13 EST 2015 | jsolloway
Hi Jeff, We have both a MY500 (4 years) and a 600 (8 months) and were the first in the UK to have both. They work well for us, enough so that we no longer use a stencil printer. Like yourselves we are a high mix CEM we make about 500 different part
Electronics Forum | Thu Jun 09 13:30:34 EDT 2005 | PWH
I would suggest 7mm thick "Durostone" as a carrier material. Cut lip/pocket for PCB so it is 0.05" thinner than thickness of PCB. Allow 0.010" gap on all sides of PCB. Machine lip to width between 0.050" and 0.100" to support under perimeter sides
Electronics Forum | Mon Oct 18 13:17:03 EDT 1999 | John Thorup
Are they visibly "popped" after wave but not before? Remember that many BGAs, especially plastic (PBGA) are very moisture sensitive and even 24 hours or less out of a controlled environment violates exposure rules.
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