Electronics Forum | Mon Jan 14 20:33:33 EST 2002 | dason_c
Can we say the "Jiffy Pop" is same as void? Also, please provide the manufacturer location, Malaysia?
Electronics Forum | Tue Oct 29 11:01:56 EST 2002 | yngwie
Ok..I will refer to the past thread myself....but, just an update, after getting the BGA rebaked ( as I didn't see an evidence from Production saying that they hv baked these batch of BGAs). The shorts are all gone. But one thing thou', if the proble
Electronics Forum | Wed Jan 26 10:43:32 EST 2011 | grahamcooper22
From our experience with our gel fluxes the depth of the flux cavity can be 30% ~ 70% of the ball diameter. You'll probably need to do some tests to find the optimum for your process. If you have really fast movement on pick and placement machine the
Electronics Forum | Tue Aug 23 22:50:09 EDT 2005 | adeline_ko
My process guy told me that. Due to black spot issue, brd with BGA must use electrolytic finishing. And when we had this finishing with plug via, the blister issue pop out. My supplier claim that this is due to the plug via. Which I don't know how
Electronics Forum | Fri Aug 19 02:16:40 EDT 2011 | ppcbs
In my opinion destructive methods went out with the stone age. At least they did at our company. We specialize in non-destructive defect analysis. We can determine where the failure is i.e. assembly process, fab defect, BGA defect or plating proce
Electronics Forum | Tue Sep 01 02:50:40 EDT 1998 | karlin
| We are experiencing shorting on a BGA. The part has a 1mm pitch with a 196 I/O count. The problem seems to pop up without warning & disappear in the same manner. | Our pad design is .020" diameter pads with .025" solder resist diameter. The ce
Electronics Forum | Sat Jan 05 10:21:29 EST 2002 | Todd Murphy
Has anyone ever had any solder related problems with the Motorola 860 BGA? We are currently using the 860 on several of our products and some of the solder joints for the 860 look like crumpled aluminum foil when viewed with the Ersa Scope. Does anyo
Electronics Forum | Sat Aug 22 15:12:32 EDT 2009 | rossi
Thank you for replying. 1) the finish is Gold Immersion (ENIG) 2) paste type EM907 SN96.5/AG3.0/CU0.5 3) it is always the same BGA but its not on the same ball every time. It is always at the joint on the PCB pad like the solder is not sticking prope
Electronics Forum | Mon Feb 28 19:36:39 EST 2000 | Tony
I work for a contract manufacture of PCB's, we are also in the BGA rework business. We see all kinds of different size boards, as well as different types of BGA's and micro BGA's. We selected the Conceptronics Freedom 2000 over the Air Vac and SRT. T
Electronics Forum | Mon Feb 28 19:36:39 EST 2000 | Tony
I work for a contract manufacture of PCB's, we are also in the BGA rework business. We see all kinds of different size boards, as well as different types of BGA's and micro BGA's. We selected the Conceptronics Freedom 2000 over the Air Vac and SRT. T
