Electronics Forum | Thu Oct 01 07:03:55 EDT 2009 | davef
We doubt that Humiseal 1A33 is causing opens in your assemblies. We'd guess the opens occur earlier in the process, but are not hard failures. So, you pass your tests. When applied, the conformal coat flows into the gap in the ball crack and insulate
Electronics Forum | Thu Jan 31 07:49:38 EST 2008 | cyber_wolf
"What do I Really Need" is a subjective question.It all depends on who you ask. I have been in small mom and pop shops that were running BGA's and they were doing some scary stuff.(I wont go into details) In order to put a correct process together y
Electronics Forum | Fri Jan 09 04:37:13 EST 2015 | jsolloway
Hi Jeff, We have both a MY500 (4 years) and a 600 (8 months) and were the first in the UK to have both. They work well for us, enough so that we no longer use a stencil printer. Like yourselves we are a high mix CEM we make about 500 different part
Electronics Forum | Thu Jun 09 13:30:34 EDT 2005 | PWH
I would suggest 7mm thick "Durostone" as a carrier material. Cut lip/pocket for PCB so it is 0.05" thinner than thickness of PCB. Allow 0.010" gap on all sides of PCB. Machine lip to width between 0.050" and 0.100" to support under perimeter sides
Electronics Forum | Mon Oct 18 13:17:03 EDT 1999 | John Thorup
Are they visibly "popped" after wave but not before? Remember that many BGAs, especially plastic (PBGA) are very moisture sensitive and even 24 hours or less out of a controlled environment violates exposure rules.
Electronics Forum | Mon Jan 14 20:33:33 EST 2002 | dason_c
Can we say the "Jiffy Pop" is same as void? Also, please provide the manufacturer location, Malaysia?
Electronics Forum | Tue Oct 29 11:01:56 EST 2002 | yngwie
Ok..I will refer to the past thread myself....but, just an update, after getting the BGA rebaked ( as I didn't see an evidence from Production saying that they hv baked these batch of BGAs). The shorts are all gone. But one thing thou', if the proble
Electronics Forum | Wed Jan 26 10:43:32 EST 2011 | grahamcooper22
From our experience with our gel fluxes the depth of the flux cavity can be 30% ~ 70% of the ball diameter. You'll probably need to do some tests to find the optimum for your process. If you have really fast movement on pick and placement machine the
Electronics Forum | Tue Aug 23 22:50:09 EDT 2005 | adeline_ko
My process guy told me that. Due to black spot issue, brd with BGA must use electrolytic finishing. And when we had this finishing with plug via, the blister issue pop out. My supplier claim that this is due to the plug via. Which I don't know how
Electronics Forum | Fri Aug 19 02:16:40 EDT 2011 | ppcbs
In my opinion destructive methods went out with the stone age. At least they did at our company. We specialize in non-destructive defect analysis. We can determine where the failure is i.e. assembly process, fab defect, BGA defect or plating proce
