Industry News | 2020-11-09 14:21:48.0
SHENMAO America, Inc. is pleased to introduce its newly developed Joint-Enhanced FluxSMEF-Z3. The new no-clean flux has been designed for fine-pitch assembly and LED die attach.
Industry News | 2020-12-01 02:52:15.0
SHENMAO America, Inc. is pleased to introduce its Joint-Enhanced Solder Paste (JEP) PF606-EP Series. JEP offers the advantages of both traditional solder paste and anisotropic conductive paste.
Industry News | 2021-03-02 14:45:26.0
SHENMAO America, Inc. is pleased to introduce its newJoint Enhanced Solder Paste (JEP) PF606-EP305 and Solder Joint Encapsulation Material (SJEM) Flux SMEF-Z52. The new epoxy-based solder materials for very fine pad size (70 μm) soldering, especially for advanced display packaging and assembly.
Industry News | 2021-03-04 08:51:46.0
SHENMAO America, Inc. has introduced its PF719-P250 thermal fatigue resistant solder alloy for automobile electronics. With a wide process window and a variety of unique features, this solder paste is ideal for even the most complicated printed circuit board (PCB) design.
Industry News | 2021-04-01 08:12:08.0
SHENMAO is pleased to announce that it has established an independent testing laboratory in Taiwan called Cheetah Inspection Inc. The ISO/IEC 17025 approved testing laboratory is located in Hsinchu, and builds upon SHENMAO's 48 years of packaging and assembly experience.
Industry News | 2021-06-08 03:45:26.0
SHENMAO America, Inc. is pleased to introduce its PF918-P250Thermal Fatigue Resistance Lead-free Solder Paste. The new paste is formulated with the new SHENMAO Sn/4Ag/3Bi Alloy design with high thermal impact reliability.
Industry News | 2021-08-26 11:02:27.0
SHENMAO America, Inc.'s Joint Enhanced Solder Paste (JEP) PF606-EP305 offers the advantages of both conventional solder paste and anisotropic conductive paste, i.e., self-alignment and planar insulation, respectively. JEP enables soldering and joint encapsulation in one step reflow.
Industry News | 2021-11-05 07:21:02.0
SHENMAO America, Inc. is pleased to announce that it received a 2021 Mexico Technology Award in the category of Solder Paste for its new PF606-P245X Lead-Free Solder Paste. The award was announced at a ceremony that took place Wednesday, Nov. 3, 2021 during SMTA International in Minneapolis, MN.
Industry News | 2022-02-25 13:23:30.0
SHENMAO America, Inc. is pleased to offer its halogen-free SM-862 Liquid Flux that can replace the widely sold halogenated SM-816. The flux features low solid content and smooth flux residue, making it suitable for automatic wave soldering and manual dipping processes.
Industry News | 2022-03-14 08:20:37.0
SHENMAO America, Inc. is pleased to introduce its PF918-P250 Thermal Fatigue Resistance Lead-free Solder Paste. The new paste is formulated with the new SHENMAO Sn/4Ag/3Bi Alloy, which is designed with high thermal impact reliability for long service life electronic products with high-reliability requirements.
