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A Look to the Future in the Electronics Industry at IPC APEX EXPO® 2013

Industry News | 2013-01-19 07:46:16.0

Information that inspires innovation is center-stage for design, printed boards, electronics assembly, test and printed electronics

Association Connecting Electronics Industries (IPC)

V9 Low-Voiding Solder Paste

V9 Low-Voiding Solder Paste

New Equipment | Solder Materials

V9 No Clean solder paste is formulated for near-zero voiding on BGA, BTC and LED soldering applications. Significant void reduction achievable on all surface finishes including ENIG, ImSn and OSP. V9 exhibits stable print performance on fine feature

AIM Solder

Future Designs, Inc.

Industry Directory |

Engineering Services Company, Electronic Engineering, Software, Embedded Systems,Prototypes, Production Supply Chain Management.

Zurvahn LLC

Industry Directory | Other

Supply chain management expert, Zurvahn is an Electronic Manufacturing Service provider for mid- to low-volume products to Original Equipment Manufacturers worldwide.

Juki 40048006 ATX PSU FH0420BP5

Juki 40048006 ATX PSU FH0420BP5

Parts & Supplies | Assembly Accessories

E21557230A0 JUKI PAD/BGA SENS UNIT R HN002290000 JUKI BEADS E2179802000 JUKI AIR CYLINDER SL6031092TN JUKI SCREW E94177210A0 JUKI F ON-LINE SW CABLE ASM.(LB-15SGS1) E92217150A0 JUKI TRANSFORMER FG CABLE ASM. JUKI 40031355 CAL PIECE V2 ASM E324

ZK Electronic Technology Co., Limited

Electronic Source Company

Industry Directory |

Electronic Source Company (ESC) is an IS9100 Certified Contract Manufacture that provides service for the electronic industries. ESC provides turnkey, quick turns, production runs, and box build service to our customers.

Multitest Develops Innovative LCR Concept for Cost Efficient, High-Performance Test Interface Boards

Industry News | 2010-11-24 13:47:37.0

Multitest's board division has successfully introduced a new LCR (layer count reduction) concept for high pin count BGA applications. Board customers now will benefit from significant cost savings without sacrificing performance. With the new LCR concept, the layer count of standard pitch BGA boards can be reduced by up to 40 percent.

Multitest Elektronische Systeme GmbH

DGTronik Sp. zo.o.

Industry Directory | Manufacturer

www.dgtronik.com.pl www.dgtronik.co.uk Contract electronic manufacturing. High mix - low/midium volumes, EMS, SMT, THT, testing, PCB, components, realization time 1-3 weeks, IPC-610-D, ISO9001:2008.

NPI Center

NPI Center

New Equipment |  

The NPI center's primary functions are rapid design validation, identifying DFM enhancements and cost reduction opportunities and facilitating a smooth transfer to production. The self-contained work-cells include staff dedicated solely to prototype

Electronic Source Company

SMT Stencils

SMT Stencils

New Equipment | Solder Paste Stencils

We use fine grain stainless steel for the base of all our Stencils, All Stencils are cut on LPKF lasers which ensures the best quality for optimum paste release. Our Stencils are offered in thicknesses from .0015" to .0020". Our laser cut Stencils c

Metal Etch Services, Inc.


bga reduction searches for Companies, Equipment, Machines, Suppliers & Information

Circuit Board, PCB Assembly & electronics manufacturing service provider

Nozzles, Feeders, Spare Parts - Siemens, Fuji, Juki, Yamaha, etc...
Thermal Interface Material Dispensing

Reflow Soldering 101 Training Course
Void Free Reflow Soldering

Software programs for SMT placement and AOI Inspection machines from CAD or Gerber.
SMT feeders

World's Best Reflow Oven Customizable for Unique Applications