Engineering Services Company, Electronic Engineering, Software, Embedded Systems,Prototypes, Production Supply Chain Management.
Supply chain management expert, Zurvahn is an Electronic Manufacturing Service provider for mid- to low-volume products to Original Equipment Manufacturers worldwide.
Parts & Supplies | Assembly Accessories
E21557230A0 JUKI PAD/BGA SENS UNIT R HN002290000 JUKI BEADS E2179802000 JUKI AIR CYLINDER SL6031092TN JUKI SCREW E94177210A0 JUKI F ON-LINE SW CABLE ASM.(LB-15SGS1) E92217150A0 JUKI TRANSFORMER FG CABLE ASM. JUKI 40031355 CAL PIECE V2 ASM E324
Electronic Source Company (ESC) is an IS9100 Certified Contract Manufacture that provides service for the electronic industries. ESC provides turnkey, quick turns, production runs, and box build service to our customers.
Industry News | 2010-11-24 13:47:37.0
Multitest's board division has successfully introduced a new LCR (layer count reduction) concept for high pin count BGA applications. Board customers now will benefit from significant cost savings without sacrificing performance. With the new LCR concept, the layer count of standard pitch BGA boards can be reduced by up to 40 percent.
Industry Directory | Manufacturer
www.dgtronik.com.pl www.dgtronik.co.uk Contract electronic manufacturing. High mix - low/midium volumes, EMS, SMT, THT, testing, PCB, components, realization time 1-3 weeks, IPC-610-D, ISO9001:2008.
The NPI center's primary functions are rapid design validation, identifying DFM enhancements and cost reduction opportunities and facilitating a smooth transfer to production. The self-contained work-cells include staff dedicated solely to prototype
New Equipment | Solder Paste Stencils
We use fine grain stainless steel for the base of all our Stencils, All Stencils are cut on LPKF lasers which ensures the best quality for optimum paste release. Our Stencils are offered in thicknesses from .0015" to .0020". Our laser cut Stencils c
ITS is a pure electronics contract manufacturing and assembly company. We offer continuing leadership in both manufacturing technology and process improvement.
Technical Library | 2022-10-31 17:09:04.0
The global transition to lead-free (Pb-free) electronics has led component and equipment manufacturers to transform their tin–lead (SnPb) processes to Pb-free. At the same time, Pb-free legislation has granted exemptions for some products whose applications require high long-term reliability. However, due to a reduction in the availability of SnPb components, compatibility concerns can arise if Pb-free components have to be utilized in a SnPb assembly. This compatibility situation of attaching a Pb-free component in a SnPb assembly is generally termed "backward compatibility." This paper presents the results of microstructural analysis of mixed solder joints which are formed by attaching Pb-free solder balls (SnAgCu) of a ball-grid-array component using SnPb paste. The experiment evaluates the Pb phase coarsening in bulk solder microstructure and the study of intermetallic compounds formed at the interface between the solder and the copper pad.
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