Electronics Forum | Thu Aug 26 14:45:09 EDT 1999 | Earl Moon
| What are the key steps to achieving high yield with CSP ??? | | (We are trying qualify vendors for volume fab/assembly of some | products which use several CSP devices on each side of the | board. (Some with 0.5mm ball pitch)) | | Looking throu
Electronics Forum | Tue May 18 16:24:25 EDT 1999 | Scott McKee
| | | | What is the best way to re-ball a BGA? Who has the best system for doing it? | | | | | | | I'm using our SRT rework stuff to reball in house - when necessary. Of course, we only do this for protos and test boards. We use a standard micro-st
Electronics Forum | Fri Dec 18 22:20:41 EST 1998 | phillip hunter
| I have developing a BGA Process and having problems with | 310 IO PBGA reflowing. I am achieving good wetting exept | 2 to 5 balls on the outer perimeter I have a good profile | my air flow is set per mfg spec, the stange thing is that | it doe
Electronics Forum | Sun Dec 20 20:40:22 EST 1998 | Miguel Mariscal
I would love to send a copy of my profile thanks, our machine is also a Summit 2000. | | I have developing a BGA Process and having problems with | | 310 IO PBGA reflowing. I am achieving good wetting exept | | 2 to 5 balls on the outer perimeter
Electronics Forum | Mon Mar 08 05:11:36 EST 1999 | Earl Moon
| | | And on it goes. Again, I can't thank you enough for your time. I will call you soon as others probably find this rhetoric a bit much. | | | | Earl Moon | | | Earl and Dean, | | No,no,no...please continue here. I've been gratefully rea
Electronics Forum | Sun Aug 15 11:02:37 EDT 1999 | Jeff Ferry
| Ladies and Gentlemen, | | As a newly appointed DFM/CE "guru" here, one of my responsibilities has become repair (of course). As I have some knowledge of BGA repair/rework using semi-automated equipment, it naturally follows I would hav tremendous
Electronics Forum | Thu Jun 17 22:10:48 EDT 1999 | Earl Moon
| | | Does anyone know where I can find a list of things to do to when troubleshooting issues during the wave solder process? | | | | | | for example: | | | | | | Solder Bridge | | | 1.verify amount of flux been aplied. | | | 2.verify turbulance on
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