Electronics Forum | Thu Feb 22 20:53:44 EST 2001 | davef
You're not sposed to pull the mask from the BGA when reworking it!!!! ;-) Well, if you insist. You can be as fancy as you want. Basically, all you need to do form a dam to prevent the solder from flowing from the pad to the via and starving the
Electronics Forum | Thu Nov 03 10:49:11 EST 2005 | russ
This is what I would propose, Place and reflow the board without the BGA with your lead process, remove the solder from the BGA pads if you cannot mask off the apertures in your stencil. Then place the BGA and reflow to SAC requirements with a rewo
Electronics Forum | Mon Jul 08 14:52:40 EDT 2013 | hegemon
The smaller ball "missing" from the lower left is from solder migrating down into the adjacent via. The solder mask may have been damaged or missing prior to mounting the BGA device. The larger balls at the top right are due to uneven heating during
Electronics Forum | Sat Mar 20 00:58:10 EST 1999 | Mike C
| After rmoving a BGA (plastic)to correct unexplained shorts | I installed another BGA using flux only. | Checking on an X Ray machine and found two shorts. | | can anyone give a good explenation ? | | Thanks | | Ron | Another possibility Via's n
Electronics Forum | Mon Oct 11 08:34:52 EDT 1999 | C.K.
Thanks for the acvice, Dave and John. Like I stated above, I didn't feel comfortable with changing wave parameters since I knew that we'd be compromising our wave quality. I'll try the peelable mask thing, reprofile, and let you guys know what i fo
Electronics Forum | Tue Feb 27 22:35:42 EST 2001 | davef
Since Mark is talking about rework, I assume his board is fairly, fully assembled. Do you have to capabilities to work in that type of environment? Or do you work with bare boards?
Electronics Forum | Tue Nov 04 16:32:22 EST 2003 | Marc
Marc, I agree with Dennis. Your best method is to apply solder mask over the pads, then install the BGA. You can also remove the balls or completely remove the pads, but it take a skill person to do it. We do all that type precise rework in Southern
Electronics Forum | Tue Feb 19 11:08:22 EST 2002 | Chris Anglin
Guideline for Tenting Interstitial BGA Vias It is difficult to give a complete recommendation on via tenting without an idea what process conditions are required (ex: wave pass, double reflow, rework etc.). Via Pads (as Test Points) - On Bottom
Electronics Forum | Sun Oct 10 17:50:00 EDT 1999 | JohnW
| | We've recently encountered this problem where one of our .050" pitch BGA's were reflowing at the wave thus causing shorts... The board was profiled with probes stuck to a QFP solder joint, an 0603, and one of the BGA joints. There was an almost
Electronics Forum | Mon Oct 11 11:13:32 EDT 1999 | Wirat S.
| | | We've recently encountered this problem where one of our .050" pitch BGA's were reflowing at the wave thus causing shorts... The board was profiled with probes stuck to a QFP solder joint, an 0603, and one of the BGA joints. There was an almo
