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MA100RR Reel-to-Reel Proximity Mask Aligner

MA100RR Reel-to-Reel Proximity Mask Aligner

New Equipment |  

The SUSS MicroTec MA100RR Reel-to-Reel Proximity Mask Aligner is specifically designed for volume production of tape for tape carrier packages (TCP) and flex based chip scale packages (CSPs), like the �BGA. The tool can also be used for products requ

SUSS MicroTec AG

New Joint Enhanced Solder Paste and Solder Joint Encapsulation Material Flux from SHENMAO

Industry News | 2021-03-02 14:45:26.0

SHENMAO America, Inc. is pleased to introduce its newJoint Enhanced Solder Paste (JEP) PF606-EP305 and Solder Joint Encapsulation Material (SJEM) Flux SMEF-Z52. The new epoxy-based solder materials for very fine pad size (70 μm) soldering, especially for advanced display packaging and assembly.

Shenmao Technology Inc.

BGA Rework Stencils

BGA Rework Stencils

New Equipment | Solder Paste Stencils

BGA Rework Stencils are now available direct to you and may be a major product improvement over what you are may be using now. FCT Assembly BGA Rework Stencils are designed to make your rework faster and cleaner. The materials used, design and precis

FCT ASSEMBLY, INC.

Sniper III Split Vision Rework System

Sniper III Split Vision Rework System

New Equipment |  

The Sniper III is the latest in BGA and Micro BGA Rework system design. With On-Board control and powerful computer profile generation, including data logging. The system also includes a Thermalcouple Bank to develop the rework profile and monitor th

APE South

Sierra Assembly Technology LLC

Industry Directory | Consultant / Service Provider / Manufacturer

Specializing in electronic circuit board assembly services. Various capabilities include engineering, assembly, designing, prototyping,supply chain management, testing, documentation, rework, repair and soldering. On-time delivery

Assembleon Flexible Mounter Topaz

Assembleon Flexible Mounter Topaz

Used SMT Equipment | Pick and Place/Feeders

Tact time: 0.20sec/chip with line array camera Simultaneous pick with 8 heads 0.45 sec/SO with line array camera Simultaneous pick with 4 heads 1.4 sec/QFP with line array camera Sequential pick with 4 heads 3.7 sec/QFP with area CCD camera In fin

Fix Trade BV

Flextac Self-Adhesive Stencils Simplify BGA Rework

Industry News | 2001-02-26 11:18:45.0

Innovative Flextac Stencils simplify BGA rework. These self-sticking laser cut, polymer solder paste stencils use a residue-free adhesive similar to Post-it Notes to seal around BGA pads to ensure that solder paste will not bleed under the stencil when the paste is applied. Disposable Flextac Stencils are easy to use and will not leave any residue on the board surface.

Circuit Technology Center, Inc.

SMTA Mexico Expo 2019

Events Calendar | Wed Oct 23 00:00:00 EDT 2019 - Thu Oct 24 00:00:00 EDT 2019 | Guadalajara, Mexico

SMTA Mexico Expo 2019

YINCAE Advanced Materials, LLC.

SMTA Mexico Expo 2019

Events Calendar | Wed Oct 23 00:00:00 EDT 2019 - Thu Oct 24 00:00:00 EDT 2019 | Guadalajara, Mexico

SMTA Mexico Expo 2019

YINCAE Advanced Materials, LLC.

Quad QSX-1

Quad QSX-1

Used SMT Equipment | Pick and Place/Feeders

Quad Pick & Place Model: QSX-1 Serial Number: 3376 Quad QSX-1 Pick and Place System Features: Dual gantry design provides placement rates up to 7,000 cph takt time Handles board sizes from 3.2" x 3" to 19.3" x 25" In-process QuadAlign touch

MAGNAProducts Inc


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