Used SMT Equipment | Pick and Place/Feeders
60,000cph with a large component range of 0201 to 30mmx30mm. Flexible, high-speed productivity for medium volume environments. A powerful line booster solution or high-performance small part placer. Dual-beam, dual-drive overhead gantry system
Eclipse Industries DS-107 Aligner Bonder The DS-107 Aligner Bonder is an ultra-high precision, high or low force aligner bonder. Constructed on a granite platform for superior stability and rigidity, the DS-107 is designed for alignment accuracy of
New Equipment | Rework & Repair Equipment
Scotle-HR360 BGA Rework Station Products Description Scotle-HR360 BGA rework station is with 7.2 inch touch screen. Scotle-HR360 applies ARM32 bit microprocessor. Scotle-HR360 can generate profile automatically during reworking process. Scotle
Used SMT Equipment | Pick and Place/Feeders
Opal XII machine in top condition. Incl. 8x SF head 2x vision Camera's Others: Optimal output per hour: 11,6k IPC 9850 output per hour: 9,6k Head design with SF: one single beam with 8 super fine heads Placing accuracy at #24; sigma: 5
Used SMT Equipment | Pick and Place/Feeders
Tact time: 0.20sec/chip with line array camera Simultaneous pick with 8 heads 0.45 sec/SO with line array camera Simultaneous pick with 4 heads 1.4 sec/QFP with line array camera Sequential pick with 4 heads 3.7 sec/QFP with area CCD camera In fin
Parts & Supplies | SMT Equipment
30534502 RELAY,SOLID STATE 30534706 RD LD C&C CABLE ASM 30534708 C&C SENS CABLE ASSY 30534901 ROT TABLE CABLE ASM 30534902 ROT TABLE CABLE ASSY 30535801 REPLACED BY: 30535802 30535802 PIN 30538301 FIBER OPTIC 30538701 COVER WIREWAY
EZReball demonstration video. Simple and Fast new reball method! The new BEST EZReball™ process is an answer to your reballing problems. This unique method simplifies the reballing process allowing for better yields and faster reballing times. http:
Industry News | 2011-03-22 16:23:31.0
Ironwood Electronics recently introduced a new BGA socket addressing high performance requirements for BGA devices - CBT-BGA-6014.
The Linx is a breakthrough in cost effective x-ray inspection and an effective means of process evaluation. This compact system is suited to a broad range of applications including BGA, flip chip, PCB layer alignment and ge
Industry News | 2022-11-15 12:33:16.0
SHENMAO America, Inc is pleased to introduce its newest offering: PF735-EP307 Joint Enhanced Solder Paste (JEP). The new low melting point epoxy-based solder material has been developed for extremely fine-pitch or fine pad soldering, especially advanced display assembly.
