Industry News | 2022-11-15 12:33:16.0
SHENMAO America, Inc is pleased to introduce its newest offering: PF735-EP307 Joint Enhanced Solder Paste (JEP). The new low melting point epoxy-based solder material has been developed for extremely fine-pitch or fine pad soldering, especially advanced display assembly.
ScanINSPECT BGA uses an intuitive process flow interface integrated with a high resolution, 2-D image-processing unit. This combination allows 100% inspection of ball placement on BGAs, in or out of trays (JDEC, etc.). This is Part 1: How to progr
Used SMT Equipment | Screen Printers
The ultimate fine pitch printer Key Features • Self learning fiducial camera's. • Digital controlled Squeegee pressure. • All machine parameters are programmable and PC controlled. • Vision for board alignment using 2 CCD cameras. • Quick-lock c
Used SMT Equipment | Screen Printers
The ultimate fine pitch printer Key Features • Self learning fiducial camera's. • Digital controlled Squeegee pressure. • All machine parameters are programmable and PC controlled. • Vision for board alignment using 2 CCD cameras. • Quick-lock c
Used SMT Equipment | Screen Printers
Speedprint SP700 avi Specs: WATCH the performance of this system NOW on our website under VIDEOS Description: This machine is as new so we will provide Installation, training and full FIVE YEAR warranty. * High Precision Axes Linear rail & bel
#Xray#Inspection#SEC Nano-focus Tube of 200 nano resolution which is specialized for sub-micron defects of Semiconductor Packaging, Wafer Level Packaging(WLP). -Non-destructive Analysis System -High-Resolution Image with Dual Type CTs -Application
Applicable to large size PCB L510 × W460. Ideal printing condition by 3S head.(3S: Swing Single Squeegee) High speed printing ability: Line tact 11.0 sec. Capable of fine adjustment for printing alignment parameter by Graphical layer base
Industry Directory | Manufacturer / Standards Setting / Certification / Training Provider
A recognized developer of solutions for the assembly & repair of highly advanced electronics. PACE provides products/training for the soldering, rework & repair of pcb's, specializing in BGA rework, desoldering & fume extraction.
Industry Directory | Consultant / Service Provider / Manufacturer
The leading provider of award winning bond testing equipment and continues to invest significantly in research and development to remain at the cutting edge of bond tester technology.
