Electronics Forum | Wed Jun 28 21:50:18 EDT 2006 | adihsr
BGA is better- in terms of 1.0 no bent leads or coplanarity problems 2.0 self align on solder pads 3. easy solder printing 4. large pitch ...I think those who goes for QFP have not had a strong SMT experience. Do not be hurt byt this is a basic SMT D
Electronics Forum | Tue May 19 13:53:53 EDT 2015 | dyoungquist
Parts will self align using Pb free paste as well. If your parts are not self aligning with Pb free paste, you have a problem with either your paste or the oven profile you are using.
Electronics Forum | Fri Apr 21 23:17:29 EDT 2006 | SD
Well, my first thought is that you need to consider lead-free rework. Depending on the alloy, some stations may not be able to reach the correct temperature. The best stations I have seen have a prism & shows both the pads and the BGA on a single v
Electronics Forum | Fri Oct 16 21:07:31 EDT 1998 | Scott McKee
| I need the following information on uBGA's - body size, ball pitch and ball diameter. Are they a plastic package (with the resulting moisture sensitivity of a PBGA)? Also, does the uBGA put any special requirements on pick and place equipment? |
Electronics Forum | Fri May 15 08:18:17 EDT 2015 | emeto
We all agree that you need to have your machine fixed. It probably needs calibration. Using Lead paste will help the parts to self align in the oven - however your misplacement should cover at least 50% of your pad. Pb free paste will not self align
Electronics Forum | Wed Oct 04 09:55:51 EDT 2006 | borgie
Hi. I have product in lead containing process that consist lead free BGAs and also big ceramic BGAs with high temperature bumbs. Pcb tends to bow in a reflow profile, since I need long preheating times and relatively high peak temperature to melt BG
Electronics Forum | Thu Aug 26 14:45:09 EDT 1999 | Earl Moon
| What are the key steps to achieving high yield with CSP ??? | | (We are trying qualify vendors for volume fab/assembly of some | products which use several CSP devices on each side of the | board. (Some with 0.5mm ball pitch)) | | Looking throu
Electronics Forum | Mon Apr 30 08:34:08 EDT 2012 | almoore
We use a small surface mount connector that has two alignment pins to ensure proper alignment. It works fairly well. I'm thinking that this simple alignment solution might work well with lead less parts like a BGA or QFN. I can hand assemble QFNs
Electronics Forum | Fri May 29 20:15:15 EDT 1998 | Steve Gregory
Whoo-doggies Jason, you said a mouthfull!! (GRIN) Anyways, 'member what I said about me being a pack-rat? Guess what? I found some documentation that I've had for a while that does document the self-alignment forces that goes on when reflowing. I ha
Electronics Forum | Thu May 14 16:09:49 EDT 2015 | hottchkisu
Hi All, > > On occasion we see components that > have gone through pick and place and are slightly > misaligned. Currently, operators manually adjust > these misaligned components to prevent reflow > failures. However, I am wondering if this >
