Electronics Forum | Mon Jan 06 23:25:29 EST 2003 | Dreamsniper
I made an experiment with our semi-auto stencil printer and used my naked eye to decide whether the alignment and deposition is pass or fail. I based the results in percentage and 100% is perfect result. Now here's the question: Can anyone tell me w
Electronics Forum | Wed Apr 11 14:57:31 EDT 2007 | itwasbill
Hi all! We are placing BGA's using a QSV-1 pck and place machine. I believe our profile has the correct information but we continue to get vision results not available when we inspect the part. Our screen appears as follows: NO RESULTS AVAILABLE PAR
Electronics Forum | Fri Mar 12 11:53:47 EST 2004 | Dreamsniper
Thanks Dave...it's such a good site for reworking BGA's (reballing). But what about when it comes to re-attaching the BGA onto the PCB? We are using Flextac Stencils but I found out that the apertures of their stencil is bigger than our pads for the
Electronics Forum | Sat Feb 14 13:33:10 EST 1998 | ashok dhawan
| I am beginner in BGA assembly and am confused in selection of centering method on pick and place operation.. As per book on 'implementation of BGA Technology-by 1995 aeic inc. states that BGAs reflow is quite forgiving and you can use Mechanical c
Electronics Forum | Tue Jun 02 08:30:30 EDT 1998 | Jon Medernach
I have to agree with Steve. If the problem is progessively worse the problem is the pitch conversion that was used, and I have seen it before. It may be masked by the solder paste which could be on pitch but after reflow the paste wickes to the pad
Electronics Forum | Thu Dec 08 01:05:34 EST 2005 | Mike_Kennedy
Our new PCB supplier can give us a 20% price reduction if we convert from an ENIG finish to a FLASH gold finish. My uderstanding between the two is as follows: ENIG - Nickel is plated over copper and then immersed in Gold which forms a self limited f
Electronics Forum | Thu Oct 30 00:12:13 EST 2003 | Grant Petty
Hi, Another option we have used here in house is to remove the unwanted BGA balls with solder wick, and then to manually place them on the PCB foot print. This eliminates the pick and place machine's optical centering freaking out because the balls
Electronics Forum | Thu Jun 13 21:44:21 EDT 2002 | jkhiew
Hi all, * Defect : termial to terminal touching btw two melfs body that created short circuit. * Clearance : 0.8mm btw two melfs body. * Size melf : diameter=2.4mm to 2.7mm, length=4.8mm to 5.2mm * Stencil opening : "v" shaped to minimise component
Electronics Forum | Mon Jan 23 21:56:50 EST 2017 | jgo
Hi all, Am new to the SMT process. I'm in the process of purchasing a new SMT Pick & Place machine and am trying to figure out how to perform the buy-off. I'm from the semiconductor packaging background. For any new machine purchase, I'm used to se
Electronics Forum | Thu Jul 17 04:42:47 EDT 2003 | sanjeevc
Hi! One technique: 1. Remove all balls 2.Make > a mask(stensil)for reballing.The holes of the > mask must be 0.8-0.9 the size of the pads. 3. > Reball chips 4. Reflow chips Good luck Hi Yes,we have done quite a bit of reballing of BGAs with
