Full Site - : bga self align (Page 10 of 65)

Speedline Accuflex

Speedline Accuflex

Used SMT Equipment | Screen Printers

MPM Speedline ACCUFLEX Screen Printer - Refurbished Model: Accuflex Vintage: 04/2005 2D post inspection Rotary Pin Placement Option Pressure Feedback Control Squeegee Head Underwipe Stencil Cleaner Fiducial Recognition for Stencil to PCA Align

Recon Inc

Soldering and Joint Encapsulation with One Step Reflow from SHENMAO

Industry News | 2021-08-26 11:02:27.0

SHENMAO America, Inc.'s Joint Enhanced Solder Paste (JEP) PF606-EP305 offers the advantages of both conventional solder paste and anisotropic conductive paste, i.e., self-alignment and planar insulation, respectively. JEP enables soldering and joint encapsulation in one step reflow.

Shenmao Technology Inc.

Assembleon Topaz X

Assembleon Topaz X

Used SMT Equipment | Pick and Place/Feeders

Assembleon Topaz X Multi-Fuction Placer With LCS Available! 4 Standard Change Heads & 4 FNC Heads Component Range:  0201 to 32mm Square   Placement Rate:18,000CPH (Chips), 2,500 (QPP)    Maximum Board Size:  460mm x 440mm (18.1" x 17.3")  

Thinking Productivity Inc

X-1 Precision SMT/BGA Rework Station

X-1 Precision SMT/BGA Rework Station

New Equipment | Rework & Repair Equipment

The X-1 Precision SMT/BGA Rework Station is a flexible system designed for manual alignment and placement or removal of BGA, microBGA, Flip Chip, CSP and other surface mount electronic components with precisely controlled solder reflow profiles. The

Precision Manufacturing Tools Div. of Prodev, Inc.

Henkel CSP and BGA Underfills

Henkel CSP and BGA Underfills

New Equipment | Materials

Henkel offers innovative capillary flow underfill encapsulants for flip-chip, CSP and BGA devices. These are highly flowable, high purity, onecomponent encapsulants. They form a uniform and void-free underfill layer to improve reliability performance

Henkel Electronic Materials

Fuji 243E PLACEMENT MACHINE

Fuji 243E PLACEMENT MACHINE

Used SMT Equipment | Flexible Mounters

Title: Fuji XP 243E Placement machine Make Fuji Model: XP 243E w/ tray tower Year of Manufacture: 2006 Description: Flexible high speed placement machine, with excellent fine pitch capabilities. It has a tray tower included so that BGA’s and

Key Tech Solutions

Ball Grid Array (BGA) Package

Industry News | 2018-12-08 03:31:22.0

Ball Grid Array (BGA) Package

Flason Electronic Co.,limited

Ekra E5

Ekra E5

Used SMT Equipment | Screen Printers

right, right--> left, left-> left, right--> right, pass through Conveyor configuration front or rear fix PCB transport width adjustment motorised, software controlled PCB warpage 1% of PCB diagonally, up to a max. of 11 mm including PCB thickness S

Recon Inc

Essemtec Expert SAFP

Essemtec Expert SAFP

Used SMT Equipment | Pick and Place/Feeders

Expert-SAFP (110V/230V configurable) NEW PRICE EUR30.000,-, now for EUR 15.000 net (excl. Tax) only. Perfect for fast and reliable Prototyping. For sale is an Essemtec Expert-SAFP (110V/230V configurable). The Expert-SAFP is a professinal semi-

Arsenal Testhouse GmbH

DIMA MP100

DIMA MP100

Used SMT Equipment | Pick and Place/Feeders

Type Pick and Place machineDimension off-line (L x W x H) 2150 x 1700 x 1500 mm (+500 mm for signal light)Dimension in-line (L x W x H) 1750 x 1300 x 1500 mm (+500 mm for signal light)Board thickness min. 0.5 mm - max. 4.5 mm thickBoard size min. 30

Fix Trade BV


bga self align searches for Companies, Equipment, Machines, Suppliers & Information

Voidless Reflow Soldering

Training online, at your facility, or at one of our worldwide training centers"
See Your 2024 IPC Certification Training Schedule for Eptac

High Throughput Reflow Oven
2024 Eptac IPC Certification Training Schedule

World's Best Reflow Oven Customizable for Unique Applications
IPC Training & Certification - Blackfox

High Precision Fluid Dispensers