Technical Library | 2009-11-05 11:17:32.0
Head-in-pillow (HiP), also known as ball-and-socket, is a solder joint defect where the solder paste deposit wets the pad, but does not fully wet the ball. This results in a solder joint with enough of a connection to have electrical integrity, but lacking sufficient mechanical strength. Due to the lack of solder joint strength, these components may fail with very little mechanical or thermal stress. This potentially costly defect is not usually detected in functional testing, and only shows up as a failure in the field after the assembly has been exposed to some physical or thermal stress.
Industry News | 2011-02-03 14:21:01.0
Ironwood Electronics recently introduced a new BGA socket addressing burn-in characterization requirements for BGA devices - CBT-BGA-6011.
Industry News | 2011-01-12 15:27:11.0
Ironwood Electronics recently introduced a new BGA socket addressing high performance requirements for testing digital camera processor - CBT-BGA-7005. The contactor is a stamped spring pin with 26 gram actuation force per ball and cycle life of 500,000 insertions.
One PCB design for test and production. Design your PCBs without socket mounting holes or hardware considerations and eliminate the need for a special test socket footprint. Grypper provides excellent signal integrity for today's high-frequency appli
Industry News | 2011-04-06 14:07:24.0
Ironwood Electronics has recently introduced a new high performance BGA socket for 1.118mm pitch, 729 pin BGA IC's. The SG-BGA-6345 socket is designed for 31X31 mm package size and operates at bandwidths up to 8 GHz with less than 1dB of insertion loss.
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Industry News | 2011-02-14 16:05:28.0
Design engineers using 0.8mm pitch 96 position BGA ICs will be interested in the PA-BGA96C-Z-01 probing and prototyping adapter with GHz BGA socket from Ironwood Electronics. Ironwood Electronics recently introduced a new BGA socket addressing high performance requirements for testing clock driver IC's. The socket is constructed with high performance and low inductance elastomer contactor.
Industry News | 2011-02-26 14:35:16.0
Ironwood Electronics has recently introduced a new high performance WLCSP socket for 0.5mm pitch 40 ball WLCSP and 0.4mm pitch 30 ball WLCSP accommodated in the same socket.
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Our expert team is equipped to deal with the most sophisticated PCB assemblies, deploying leading-edge technologies such as the Air Vac DRS-24C BGA Rework Station to overcome the most complex process challenges. To give you a better idea of how we c
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