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BGA Reballing

BGA Reballing

New Equipment |  

Salvage indispensible Ball Grid Arrays. Artek Manufacturing will: *Clean and Bake out all contaminants and moisture *Clean out all exsisting Solder *Replace solder spheres according to manufacture's specs *Bake out BGA prior to packing in MSD package

Artek Manufacturing Inc

BPM Releases High-performance Socket Technology.

Industry News | 2007-11-04 19:59:12.0

HOUSTON � November 1, 2007 � BPM Microsystems announced today the introduction of high-performance sockets specifically designed for lead-free BGA devices.

BPM Microsystems, Inc.

Aries' New Cost-Effective CSP/MicroBGA Test and Burn-In Socket

Industry News | 2003-07-08 09:09:15.0

Available for Devices Up to 13 mm2 with Speeds Up to 1 GHz

Aries Electronics Inc

Quick-Turn BGA Rework Services

New Equipment | Rework & Repair Services

Our shortest turnaround-Time for BGA Rework / Reballing Services is within 24 Hrs. We are capable of reworking precision complex components such as shown below:(1) Any type of land grid array package and/or socket, including PBGA, CBGA, CCGA, High I/

Sparqtron Corporation

Tape and Reel Capabilities

New Equipment |  

Chips, SOIC's, SSOP's, SOJ's, PLCC's, BGA's, socket's, QFP's, Odd form devices, connectors, switches and any custom components.

Advanced Component Packaging

Chipmaster

Chipmaster

New Equipment |  

From plastic sockets to ceramic BGA components, the Chipmaster Rework system provides a controlled environment, which cares for your repair process. Features simple operation with "Timed" process control and selected thermal profiling

A.P.E. South

JOT Optical BGA Rework Station FG-

JOT Optical BGA Rework Station FG-

Parts & Supplies | Repair/Rework

Three independent heaters control systems. FG-P6000 is available heating portion of the PCB board by hot-air circulate both from top and bottom at the same time. With large IR bottom heating, it can completely avoid PCB deformation during reworking

Goodluck Electronic Equipment Co.,Ltd

BGA / SMT Rework & Repair

BGA / SMT Rework & Repair

New Equipment | Rework & Repair Services

Many Fortune 500 clients, and numerous other OEMs and contract manufacturers of micro-electronics rely on Process Sciences to service, modify, reclaim, upgrade, and/or repair their circuit assemblies and array devices. PSI knows solder! Please rememb

Process Sciences, Inc.

BGA Reballing Services

BGA Reballing Services

New Equipment | Rework & Repair Equipment

Visit PSI's main BGA Reballing Services page for more information. PSI has over 20 years experience reballing BGA devices of every size, pitch, and package style: micro-BGAs Alloy conversion from Sn/Pb to Pb-free, or Pb-free to Sn/Pb Reclaim a

Process Sciences, Inc.

NEW ARIES SHORTFORM CATALOG COVERS PIN BALL BGA

Industry News | 2004-11-10 18:04:10.0

Frenchtown, NJ, November 2004

Aries Electronics Inc


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