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Level Transmitter PCB Assembly - Electronic Contract Manufacturing - Grande Electronics

Level Transmitter PCB Assembly - Electronic Contract Manufacturing - Grande Electronics

New Equipment | Assembly Services

Supplier: Shenzhen Grande Electronics Layers:2 Application: Level Transmitter PCB Assembly - Electronic Contract Manufacturing - Grande Electronics PCB: FR4/1.0mm, 1oz finished copper Min Via: 0.2mm Surface Treatment: HASL PCBA Lead time: 2-3 weeks

Shenzhen Grande Electronics Co., Ltd

Attendance Control System Quick PCB Prototype Assembly- Shenzhen Grande

Attendance Control System Quick PCB Prototype Assembly- Shenzhen Grande

New Equipment | Board Handling - Conveyors

Supplier: Grande Electronics Layers: 4 Application: Attendance Control System Quick PCB Prototype Assembly- Shenzhen Grande PCB:FR4/1.6mm/1oz Min Via: 0.2mm Surface Treatment: HASL PCBA Lead time: 3-4 weeks Testing: 100% E-test Standard Warp: [D

Shenzhen Grande Electronics Co., Ltd

Packaging Machine Complete PCB Assembly- Quality PCBA Company Grande

Packaging Machine Complete PCB Assembly- Quality PCBA Company Grande

New Equipment | Board Handling - Storage

供應商:格蘭德電子 層數:4 應用:包裝機 完整的 PCB 組裝-優質 PCBA 公司 Grande PCB:FR4/1.6mm/1oz 最小通孔:0.2mm 表面處理:ENIG PCBA 交貨時間:3-4 週 測試:100% 電子測試 標準翹曲: [Description] 1, Turnkey solution for Packaging Machine Complete PCB Assembly- PCBA Company Shenzhen Grande 2, PCB Ass

Shenzhen Grande Electronics Co., Ltd

Weighing Scales PCB Assembly - Fast Electronic Prototype‎

Weighing Scales PCB Assembly - Fast Electronic Prototype‎

New Equipment | Assembly Services

Supplier: Shenzhen Grande Electronic Layers: 4 Application: Weighing Scales PCB Assembly - Fast Electronic Prototype‎ PCB:FR-4/1.6mm, 2oz finished copper Specialty: Large current, High heat, heavy components Surface Treatment: HASL PCBA Lead time: 3-

Shenzhen Grande Electronics Co., Ltd

Inovar Invests in Nordson DAGE’s X-ray System to Improve Defect Detection

Industry News | 2016-05-16 20:44:43.0

Inovar, Inc., a full-service EMS provider, announces that it recently purchased and installed an XD7600NT Ruby X-ray Inspection System with X-Plane™ technology from Nordson DAGE.

Inovar, Inc.

SHENMAO Exhibits at ECTC in Las Vegas June 1-2, 2016 Booth # 505 Introduces PF606-P116 / PF606-P128 / PF606-XP LED Die Bonding Solder Pastes

Industry News | 2016-06-05 13:20:49.0

SHENMAO PF606-P116 Halogen Free Water Soluble LED Die Bonding Solder Pastes are made locally in the USA and with the same quality in 8 other worldwide locations.

Shenmao Technology Inc.

Official PACE IR 3000 Tutorial - Install and Remove BGA and SMC

Official PACE IR 3000 Tutorial - Install and Remove BGA and SMC

Videos

"The IR 3000 offers advanced surface mount rework capability in an integrated, cost-effective, bench-top work station." This video covers the basic processes of the IR 3000, focusing primarily on: Installations, Removals, Component Alignment and Ins

PACE Worldwide

Circuit Technology Center Partners with Hentec RPS to Provide World-Class Component Modification Services

Industry News | 2022-01-24 18:01:46.0

Available component modification services utilizing Hentec/RPS Odyssey RHSD systems include BGA de-balling, gold mitigation, lead tinning and tin whisker mitigation.

Hentec Industries, Inc. (RPS Automation)

Retronix Installs Hentec/RPS Lead Tinning Machine in Scotland Facility

Industry News | 2021-05-04 13:53:27.0

Odyssey 1750 provides high reliability BGA alloy exchange and component re-finishing capabilities.

Hentec Industries, Inc. (RPS Automation)

SHENMAO Offers Enhanced Solder Joint Encapsulation Material Flux

Industry News | 2022-06-24 10:13:15.0

SHENMAO America, Inc. is pleased to offer its enhanced Solder Joint Encapsulation Material (SJEM) SMEF-Z52 Flux. The SJEM Flux combines the abilities of conventional flux and underfill. The epoxy cures after reflow and provides excellent bonding strength and joint protection. Joint reliability performance is elevated as well.

Shenmao Technology Inc.


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