New Equipment | Assembly Services
Supplier: Shenzhen Grande Electronics Layers: 4 PCB：FR-4/1.6mm, 1oz finished copper Project: Parking Equipment and Systems PCB Assembly Process | Introduction To PCBA | PCBA Grande Surface Treatment: ENIG PCBA Lead time:2-3 weeks Packing: Anti-stati
New Equipment | Assembly Services
Supplier: Shenzhen Grande Electronics Layers:2 Application: Level Transmitter PCB Assembly - Electronic Contract Manufacturing - Grande Electronics PCB: FR4/1.0mm, 1oz finished copper Min Via: 0.2mm Surface Treatment: HASL PCBA Lead time: 2-3 weeks
New Equipment | Assembly Services
Supplier: Shenzhen Grande Electronic Layers: 4 Application: Weighing Scales PCB Assembly - Fast Electronic Prototype PCB:FR-4/1.6mm, 2oz finished copper Specialty: Large current, High heat, heavy components Surface Treatment: HASL PCBA Lead time: 3-
New Equipment | Board Handling - Conveyors
Supplier: Grande Electronics Layers: 4 Application: Attendance Control System Quick PCB Prototype Assembly- Shenzhen Grande PCB:FR4/1.6mm/1oz Min Via: 0.2mm Surface Treatment: HASL PCBA Lead time: 3-4 weeks Testing: 100% E-test Standard Warp: [D
New Equipment | Board Handling - Storage
供應商：格蘭德電子 層數：4 應用：包裝機 完整的 PCB 組裝-優質 PCBA 公司 Grande PCB：FR4/1.6mm/1oz 最小通孔：0.2mm 表面處理：ENIG PCBA 交貨時間：3-4 週 測試：100% 電子測試 標準翹曲： [Description] 1, Turnkey solution for Packaging Machine Complete PCB Assembly- PCBA Company Shenzhen Grande 2, PCB Ass
Industry News | 2016-05-16 20:44:43.0
Inovar, Inc., a full-service EMS provider, announces that it recently purchased and installed an XD7600NT Ruby X-ray Inspection System with X-Plane™ technology from Nordson DAGE.
Industry News | 2016-06-05 13:20:49.0
SHENMAO PF606-P116 Halogen Free Water Soluble LED Die Bonding Solder Pastes are made locally in the USA and with the same quality in 8 other worldwide locations.
"The IR 3000 offers advanced surface mount rework capability in an integrated, cost-effective, bench-top work station." This video covers the basic processes of the IR 3000, focusing primarily on: Installations, Removals, Component Alignment and Ins
Industry News | 2022-01-24 18:01:46.0
Available component modification services utilizing Hentec/RPS Odyssey RHSD systems include BGA de-balling, gold mitigation, lead tinning and tin whisker mitigation.
Industry News | 2021-05-04 13:53:27.0
Odyssey 1750 provides high reliability BGA alloy exchange and component re-finishing capabilities.
