Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
Industry News | 2021-10-18 12:49:19.0
Odyssey 1325 provides high reliability BGA alloy exchange and component re-finishing capabilities.
Industry News | 2021-09-07 11:14:42.0
Odyssey 1325 provides high reliability BGA alloy exchange and component re-finishing capabilities.
Industry News | 2022-03-07 16:53:18.0
Odyssey 1325 provides high reliability BGA alloy exchange and component re-finishing capabilities.
Industry News | 2021-11-29 14:55:05.0
A full range of automated selective soldering machines, component lead tinning systems and solderability test equipment will be on exhibit.
Industry News | 2017-10-17 19:47:15.0
Nordson DAGE, Nordson MATRIX, and Nordson YESTECH, divisions of Nordson Corporation (NASDAQ: NDSN), will exhibit in Hall A2 Booth 445 at productronica 2017, scheduled to take place Nov. 14-17, 2017 at the Messe München in Germany.
Industry News | 2016-04-04 09:33:43.0
Nordson DAGE, MatriX Technologies and Nordson YESTECH, divisions of Nordson Corporation (NASDAQ: NDSN), will exhibit their range of market leading Test and Inspection systems in Hall 7A, Booth 329 at the forthcoming SMT/Hybrid/Packaging, scheduled to take place April 26-28, 2016 at the Messe in Nuremberg, Germany.
Industry News | 2021-02-17 11:49:45.0
A full range of automated selective soldering machines, component lead tinning machines and solderability test equipment will be on exhibit.
Industry News | 2022-11-28 07:00:51.0
With the development of the precision and stability of SMT equipment, the manufacturing process and testing links have gradually become the key to the development of the industry. At the same time, the fierce competition in the consumer electronics market has put forward higher requirements for the quality of electronic components. In the production process, it is necessary to use various testing technologies to inspect defects and faults in time and repair them, among these testing technologies, X-ray inspection is one of the most critical process to improve the SMT BGA QFN soldering quality.
Industry News | 2010-09-27 23:15:26.0
VJ Technologies, Inc., the leader in rework technologies and global provider of advanced X-ray inspection systems, announces that Intel’s James Wade and Raiyo Aspandiar, along with VJ Technologies’ Donald Naugler and Terry Leahy will present a paper titled “PCB Pad Site Dress Methods on BGA and Socket Pad Arrays” at the upcoming SMTA International, scheduled to take place October 24 - 28, 2010 at the Walt Disney World Swan and Dolphin Resort in Orlando, FL.
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