Industry News | 2003-03-21 08:12:24.0
Tecan reckons it is consistently producing what may be regarded as the most efficient stencils in the world today.
Industry News | 2003-06-04 09:19:23.0
With increasing demand for fine pitch placements and a growing amount of fast turnaround high-tech low-volume prototype work, Speedboard has invested in additional SMT/BGA placement/rework equipment.
Industry News | 2015-04-07 11:25:45.0
MIRTEC will highlight its award-winning 2D/3D In-Line AOI Series configured with MIRTEC’s exclusive OMNI-VISION® 3D Inspection Technology in its distributor pb tec solutions’ booth, # 7A-504, at the SMT/Hybrid/Packaging 2015 exhibition, scheduled to take place May 5-7, 2015 at the Messe in Nuremberg, Germany.
Technical Library | 2020-12-02 20:36:54.0
Industry 4.0 is a topic of much discussion within the electronics manufacturing industry. Manufacturers and vendors are trying to come to terms with what that means. In the most simplistic of terms, Industry 4.0 is a trend toward automation and data exchange within the manufacturing process. This basically requires connectivity and communication from machine to machine within the manufacturing line. The challenge is to collect data from each of the systems within the line and make that data available to the rest of the machines. Without test and inspection, there is no Industry 4.0. The whole purpose of test and inspection is to collect actionable data that may be used to reduce defects and maximize efficiency within the manufacturing line. The goal is to minimize scrap and get a really good handle on those process parameters that need to be put in place to manufacture products the right way the first time. For maximum efficiency, three inspection systems are required within the production line. These are solder paste inspection (SPI) post-solder deposition, automated optical inspection (AOI) post-placement, and AOI post-reflow. This requires a substantial investment; however, the combination of all three inspection machines is really the only true way to provide feedback for each stage of the manufacturing process.
Industry News | 2003-03-13 08:19:18.0
The Flakafix 2.54mm grid IDC board-to-cable connector can now be supplied with a variety of terminations including surface mount, solder-in, press-fit and pin-in-paste.
Industry News | 2015-05-07 19:28:29.0
MIRTEC announce a new strategic cooperation that will empower yield improvement in the electronics manufacturing industry.
Industry News | 2015-08-24 14:59:01.0
MIRTEC, “The Global Leader in Inspection Technology,” announces that it will exhibit in Booth #407 at SMTA International, scheduled to take place Sep. 29-30, 2015 at the Donald Stephens Convention Center in Rosemont, IL. Company representatives will showcase the latest advancement MIRTEC’s award-winning 3D AOI and SPI systems during the two-day event.
Industry News | 2018-10-15 18:51:46.0
MIRTEC, “The Global Leader in Inspection Technology,” is pleased to announce plans to exhibit its award-winning MV-6 OMNI 3D AOI System and MS-11e 3D SPI Machine at the SMTA Guadalajara Expo & Tech Forum, scheduled to take place Nov. 14 - 15, 2018 at the Expo Guadalajara.
Industry News | 2019-08-21 16:55:59.0
MIRTEC will exhibit in Booth #305 at SMTA International. MIRTEC will showcase the latest advancements in their award-winning 3D AOI and SPI Systems at the two-day event.
Industry News | 2019-09-23 16:01:19.0
MIRTEC will exhibit at the SMTA Guadalajara Expo & Tech Forum, scheduled to take place Oct. 23-24, 2019 at the Expo Guadalajara. The MIRTEC team will showcase the all new MV-6 OMNI 3D AOI Machine and award-winning MS-11e 3D SPI Machine.
