Electronics Forum | Wed Jan 03 12:33:37 EST 2001 | Terry Burnette
John, There is one process issue that occurs with the larger BGA packages which have coplanarity near the high end of the .2mm spec.. The defect is commonly referred to as "ball in cup" and "head in pillow". It is an open solder connection whereby th
Electronics Forum | Thu Mar 02 21:51:46 EST 2000 | Dave F
Robert: Consider requesting samples of different sized solder balls from a variety of suppliers, solder them to dummy boards, and compare the size of reflowed balls to your spec. Then you could buy based on results. My2� Dave F
Electronics Forum | Thu Mar 02 21:51:46 EST 2000 | Dave F
Robert: Consider requesting samples of different sized solder balls from a variety of suppliers, solder them to dummy boards, and compare the size of reflowed balls to your spec. Then you could buy based on results. My2� Dave F
Electronics Forum | Sun Jan 25 10:39:55 EST 1998 | Rich Breault
| Does anyone have any information on reballing BGA devices? | I'm looking for specs, a process flow, and what tests | should be performed afterward. | Also, I'm looking for any companies that contract this | service. | Thanks. Hello Allan, We at NET
Electronics Forum | Sun Jan 25 10:39:52 EST 1998 | Rich Breault
| Does anyone have any information on reballing BGA devices? | I'm looking for specs, a process flow, and what tests | should be performed afterward. | Also, I'm looking for any companies that contract this | service. | Thanks. Hello Allan, We at NET
Electronics Forum | Fri Jun 15 12:08:49 EDT 2007 | ck_the_flip
Hi Grant, 1st off solder paste data sheets are just "guidelines". You always need to set your specs. based on the needs of your own process and product. Don't ever follow your solder-paste data sheet to the tee, or you're severely limiting yoursel
Electronics Forum | Thu Jan 22 15:51:08 EST 2004 | solderboffin
CBGA devices are a bit trickier to reball than run of the mil plastic devices. Once assemblied they are a bit like a sandwich when fitted to a PCB. From top to bottom it goes BGA device - Eutectic solder - High temp solder ball - eutectic solder -
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