Industry News | 2009-02-03 13:34:04.0
New PCB Rework, Repair, Fabrication Training & Consulting Services.
High Performance Reflow Soldering Oven ❙ Introduce of Reflow Oven High performance reflow soldering oven, SMT reflow oven, soldering oven, SMD soldering machine, for soldering surface mount components to a printed circuit board or PCB. 1.
High Performance Reflow Soldering Oven ❙ Introduce of Reflow Oven High performance reflow soldering oven, SMT reflow oven, soldering oven, SMD soldering machine, for soldering surface mount components to a printed circuit board or PCB. 1.
High Performance Reflow Soldering Oven ❙ Introduce of Reflow Oven High performance reflow soldering oven, SMT reflow oven, soldering oven, SMD soldering machine, for soldering surface mount components to a printed circuit board or PCB. 1.
High Performance Reflow Soldering Oven ❙ Introduce of Reflow Oven High performance reflow soldering oven, SMT reflow oven, soldering oven, SMD soldering machine, for soldering surface mount components to a printed circuit board or PCB. 1.
Technical Library | 2020-05-08 18:22:31.0
A customer contacted the Helpline to perform analysis on a lead-free assembly which exhibited intermittent functionality. The lead-free assembly exhibiting intermittent functionality when pressure was applied to the ball grid array (BGA) packages. Industrial adaptation of a Restriction of Hazardous Substances (RoHS) compliant solder standard has created a new host of failure modes observed in lead-free assemblies. Pad cratering occurs when fractures propagate along the epoxy resin layer on the underside of the BGA connecting pads. While originating from process, design, and end use conditions, it is the combination of a rigid lead-free solder with inflexible printed circuit board (PCB) laminates that has advanced the prevalence of this condition. Pad cratering is simply the result of mechanical stress exceeding material limitations.
Technical Library | 2020-11-09 16:59:53.0
A customer contacted ACI Technologies regarding a high failure rate of their assemblies. They provided assemblies to be X-rayed and inspected for the purpose of identifying any process related issues such as (but not limited to) solder and assembly workmanship and evidence of damage due to moisture related problems during reflow (a.k.a. "popcorning"). Moisture damage usually appears as physical damage to the component. The first indication of moisture damage would be externally observable changes to the package in the form of bulging or fractures to the outer surface of the component, an example of which is shown in Figure 1. Internally observable indicators of moisture damage typically include fractures to the die inside the package and lifted or fractured wire bonds. These conditions would be apparent during transmissive X-ray inspection. Another symptom of moisture related damage would be inconsistent solder joint sizes that result from package deformation during the liquidus phase of the reflow process. None of these indicators of moisture related damage were present on the customer samples.
Industry News | 2013-02-14 08:18:47.0
IPC – Association Connecting Electronics Industries® has announced the winners of the Best U.S. and International Papers of IPC APEX EXPO® 2013
Industry News | 2020-03-19 11:12:48.0
Amid the COVID 19 crisis, Precision PCB Services, Inc. remains open and cable to provide quick turn BGA Rework and Reballing Services with offices in Northern California and Dallas, Texas.
Industry News | 2022-10-13 07:44:15.0
I.C.T SMT Vacuum Reflow Oven Machine helps you to solve the problem of High Solder Voids Rates
