New Equipment | Rework & Repair Equipment
A lot of machine for an affordable price! The Model WDS-650 BGA Rework System has an 8mp High Resolution Split Vision Optical System for Removal, Placement, and Soldering of BGAs, CGA's, CSPs, QFPs, LGA's and Other SMDs.&n
New Equipment | Rework & Repair Equipment
The Model WDS-750 BGA Rework System has an 8mp High Resolution Split Vision Optical System for Removal, Placement, and Soldering of BGAs, CGA's, CSPs, QFPs, LGA's and Other SMDs. Features: High Resolution V
BGA component installation demo with the Shuttle Star SV560 that has the Side View Camera option.
Industry News | 2023-08-03 11:31:37.0
PCB/BGA Rework and Training Facility now in Plano, Texas
8 Zones Lead-free Reflow Oven High quality lead-free Reflow Oven, reflow soldering, reflow soldering oven, SMT reflow oven, soldering oven, IR reflow, SMD soldering machine, for SMT LED production line. ❙ Introduce of Reflow Oven 1. Control Syst
CBS Reflow Oven Machine - Advanced SMT Soldering Solution for Precision Assembly ❙ Introduce of Reflow Oven I.C.T is focused on providing advanced Reflow Oven and technology to electronics manufacturers. The I.C.T reflow oven control system is co
Technical Library | 2019-05-30 10:59:13.0
In the current economic environment, the ability to reuse ball grid array(BGA) components that have failed due to solder defects may be an efficient way for electronics manufacturers to reduce costs. Cost may not be the only driving factor in the decision to engage in this recycling practice. The increasing demands placed upon the complexity of microprocessors and integrated circuits (ICs) has decreased the availability of some components, and increased their lead time. Because of this, reballing may provide a means to meet schedule, reduce rework turn-around time, and give a manufacturer a decisive advantage over other companies in an ever increasingly competitive market. This article will discuss the process of reballing BGA components (Figure 1), examining preparation (the preform method, the screen method), and cleaning and bake-out.
New Equipment | Education/Training
This two day course is based on the IPC-7721. Students will learn how to repair surface mount pads, BGA pads, finger contacts, traces, laminate, plated through holes and more. Students will be introduced to the proper techniques for SMT & PTH compon
SMT Reflow Solder Oven for Soldering Components ❙ Introduce of Reflow Soldering Oven ETA advanced reflow oven, reflow soldering, reflow soldering oven, SMT reflow oven technology | 25 years SMT technology experience | professional o
Events Calendar | Tue Feb 19 00:00:00 EST 2019 - Tue Feb 19 00:00:00 EST 2019 | Elkridge, Maryland USA
SMTA Capital Chapter: Non-Destructive BGA/Area Array Component Rework
