Used SMT Equipment | Chipshooters / Chip Mounters
Advanced Flexible Mounter Using the vision system which is upgraded from the SM421 vision system, the SM421 can be applied to parts from 0603(0201) microchip to 22mm IC part through On-The-Fly recognition. It also allows recognition of parts with
Used SMT Equipment | X-Ray Inspection
Yestech High Resolution Imaging PCB Xray Serial Number: X10706656 Model Number: YTX 3000 Year 2007-2008 130 KV XrayTube with 5 micron spot size Xray on Hours - 18.2 Standby Hours - 328.5 Measured Filament - 2.22 Hamamatsu L19181-02 Sam
Used SMT Equipment | X-Ray Inspection
Yestech High Resolution Imaging PCB Xray Serial Number: X10706656 Model Number: YTX 3000 Year 2007-2008 130 KV XrayTube with 5 micron spot size Xray on Hours - 18.2 Standby Hours - 328.5 Measured Filament - 2.22 Hamamatsu L19181-02 Sample Ma
New Equipment | Rework & Repair Services
On the cutting edge of technology, we offer a full line of high tech services to assist contract manufacturer's and product research and developers. Specializing in quick turn around times to help get your product to market on time. Training Serv
Used SMT Equipment | Pick and Place/Feeders
Yamaha YV100xg placement machine parameters High-speed, high-precision, multi-functional modular placement machine 0.18 seconds/CHIP ultra-high-speed placement (best conditions) 16200CPH (grains/hour) In the IPC9850 state, the patch speed is as high
BGA component installation demo with the Shuttle Star SV560 that has the Side View Camera option.
Industry News | 2023-08-03 11:31:37.0
PCB/BGA Rework and Training Facility now in Plano, Texas
Technical Library | 2019-05-30 10:59:13.0
In the current economic environment, the ability to reuse ball grid array(BGA) components that have failed due to solder defects may be an efficient way for electronics manufacturers to reduce costs. Cost may not be the only driving factor in the decision to engage in this recycling practice. The increasing demands placed upon the complexity of microprocessors and integrated circuits (ICs) has decreased the availability of some components, and increased their lead time. Because of this, reballing may provide a means to meet schedule, reduce rework turn-around time, and give a manufacturer a decisive advantage over other companies in an ever increasingly competitive market. This article will discuss the process of reballing BGA components (Figure 1), examining preparation (the preform method, the screen method), and cleaning and bake-out.
Events Calendar | Tue Feb 19 00:00:00 EST 2019 - Tue Feb 19 00:00:00 EST 2019 | Elkridge, Maryland USA
SMTA Capital Chapter: Non-Destructive BGA/Area Array Component Rework
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
