Electronics Forum | Wed Dec 02 20:41:13 EST 2015 | slouis2014
Thanks for the link. Their is a white silkscreen underneath the BGA instead of a green soldermask. Attached is a picture of the BGA. Does these affect the solderability for the component.
Electronics Forum | Thu Oct 14 17:14:39 EDT 2004 | mattkehoe
We are experiencing a problem with soldermask defined BGA pads not accepting solder during the reflow process. The paste is there when the boards come off the printer but after reflow, no paste. Some other pads in the same pattern are fine. Here is t
Electronics Forum | Thu Mar 29 15:50:35 EST 2001 | tomgervascio
We've think that with seen solder shorts under BGAs after wave soldering the boards. In addition, it seems to be related to a certain soldermask configuration over the topside BGA vias.. THere is one vendor,A, that is applying soldermask after HASL,
Electronics Forum | Fri Oct 15 10:23:48 EDT 2004 | mrmaint
Matt, are there any discoloration of the pads on the raw boards. i have seen what we refer to as gray pads. Ran into this in the past and it turned out to be a problem at the board house with one of their dipping tanks. The proper levels for the proc
Electronics Forum | Fri Oct 15 10:38:42 EDT 2004 | mattkehoe
Thats what I was thinking especially because the pads are not round, they have jagged edges which to me indicates some kind of development issue. mk
Electronics Forum | Fri Dec 10 08:42:37 EST 2004 | mattkehoe
We had some bad experiences trying to work with soldermask defined BGA pads. If the opening in the soldermask is right to the edge of the copper/pad without a space it can leave reside on the pad and nothing will stick to it. See http://www.sipad.com
Electronics Forum | Mon Feb 21 11:22:21 EST 2000 | K. Ckak
Hi Kurt, I agree with Dave F. I had exact same problem with PBGA placement. We requested our PCB vendor to plug/tent via (button printing) after HASL with SR1000 which worked well in the long run. There are couple of failure modes associated wit
Electronics Forum | Mon Feb 21 11:22:21 EST 2000 | K. Ckak
Hi Kurt, I agree with Dave F. I had exact same problem with PBGA placement. We requested our PCB vendor to plug/tent via (button printing) after HASL with SR1000 which worked well in the long run. There are couple of failure modes associated wit
Electronics Forum | Mon Oct 18 09:41:56 EDT 1999 | Wolfgang Busko
That should not happen. There are some threads concerning BGA and wavesoldering you could look for. It�s said that you should protect the vias in the BGA-area by soldermask or at least with tented vias to prevent rereflow of BGAs solderjoints what co
Electronics Forum | Wed Oct 20 06:23:54 EDT 2004 | C Lampron
Hi Matt, Sounds like the HASL may be to thin on some pads and you're getting copper migration. If this is the case, and the solder paste is printing, I would asume you would see some solder balls under the BGA at X-Ray or incosistancies in ball size
