Electronics Forum | Fri Oct 15 08:01:05 EDT 2004 | jmedernach
Hi Matt, You've got an interesting problem. Sounds like something from an X-Files episode but it's still interesting. In your posting, you say that the paste is "there" after screen printing. Release isn't the greatest with a 0.012" round aperture
Electronics Forum | Thu Aug 23 20:31:53 EDT 2001 | davef
We never underfill BGA, but then again our products are not blasted into space. Certainly you need to provide enough room for the dispense head to move around the component in the pattern appropriate for the underfill you plan to use. Probably more
Electronics Forum | Wed Feb 16 21:51:29 EST 2000 | Dave F
Kurt: Lots of choices, not many of them good, yano. 1 So LPI has taken over the market pretty nearly 100%, but it won't "tent" reliably, because it is not very viscous when applied and drops into the hole. So then, tenting/plugging with LPI is bad
Electronics Forum | Wed Feb 16 21:51:29 EST 2000 | Dave F
Kurt: Lots of choices, not many of them good, yano. 1 So LPI has taken over the market pretty nearly 100%, but it won't "tent" reliably, because it is not very viscous when applied and drops into the hole. So then, tenting/plugging with LPI is bad
Electronics Forum | Sun Apr 16 14:37:25 EDT 2000 | Roberto Navarro
Hi, I work for Nortel and here rework BGA'S we use DRS22 rework station and CRT 2000 X-ray inspection. The main problem is put again the BGA on the PCB because you need reboling the PCB and you could damage the soldermask. Talking about Air-vac is ve
Electronics Forum | Tue Feb 27 11:28:08 EST 2001 | fkurisu
Hello Mark, It is possible that SolderMask, Inc. could selectively remove the existing solder mask, clean and reapply a Photoimageable solder mask to the BGA area. Mostly likely the mask on your boards is a Liquid Photoimageable Solder Mask (LPIS
Electronics Forum | Mon Apr 22 15:05:47 EDT 2002 | tim_easterling
Depending on the volume of boards you are manufacturing, the most cost effective solution would be to epoxy plug the vias prior to LPI soldermask application. The technique is common practice and most suppliers can provide it will little or no cost a
Electronics Forum | Fri Nov 03 02:32:56 EST 2006 | shivam
HI ALL, can anybody clear me what is via tenting and via pluging?? second one, if i use via in pad for an.5mm bga what care i should taken, what should be the soldermask open in top and innerlayers for via?how it will directly connect to top layer
Electronics Forum | Fri Mar 17 14:53:08 EST 2006 | Board House
Hi Brad, Being that I work for a board house here is my take on this issue. In the past it used to be 1 scrap per palt up to 10% of the total order. scrap is supposed to be sepperated to location and packaged sepertaly. Then it turned into No Scra
Electronics Forum | Wed Feb 28 09:53:17 EST 2001 | fkurisu
Hello Dave, Solder mask rework has been performed on both bare and populated boards. There are factors that come into play with a populated board that make this type of rework more difficult, such as the density of components(especially around th
