Samsung SM481 Pick and Place Machine Samsung SM481 Pick and Place Machine Chip theoretical speed 39,000CPH 1650 X 1680 X 1530MM weight 1655KG Product description: Samsung SM481 Pick and Place Machine Samsung SM481 Pick and Place Machine P
Samsung SM481 Chip Mounter Samsung SM481 Chip Mounter Chip theoretical speed 39,000CPH 1650 X 1680 X 1530MM weight 1655KG Product description: Samsung SM481 Chip Mounter Samsung SM481 Chip Mounter Product Features: Products Descr
Samsung SM481 Chip Mounter Samsung SM481 Chip Mounter Chip theoretical speed 39,000CPH 1650 X 1680 X 1530MM weight 1655KG Product description: Samsung SM481 Chip Mounter Samsung SM481 Chip Mounter Product Features: Products Descri
Samsung SM481 Chip Mounter Samsung SM481 Chip Mounter Chip theoretical speed 39,000CPH dimension:1650 X 1680 X 1530MM weight 1655KG Product description: Samsung SM481 Chip Mounter,Chip theoretical speed 39,000CPH, 1650 X 1680 X 1530MM,weight 1
Samsung SM481 Chip Mounter Samsung SM481 Chip Mounter Chip theoretical speed 39,000CPH 1650 X 1680 X 1530MM weight 1655KG Product description: Samsung SM481 Chip Mounter,Chip theoretical speed 39,000CPH, 1650 X 1680 X 1530MM,weight 1655KG &
Samsung SM481 Pick and Place Machine Samsung SM481 Pick and Place Machine Chip theoretical speed 39,000CPH 1650 X 1680 X 1530MM weight 1655KG Product description: Samsung SM481 Pick and Place Machine,Chip theoretical speed 39,000CPH,1650 X 1680
Samsung SM481 Chip Mounter machine Samsung SM481 Chip Mounter Chip theoretical speed 39,000CPH 1650 X 1680 X 1530MM weight 1655KG Product description: Samsung SM481 Chip Mounter machine INQUIRY Samsung SM481 Chip Mounter machine Machi
Career Center | Space Coast, Florida USA | Engineering,Research and Development
Board Level Assembly BGA Expert! We are in need of an Electronic Packaging or Advanced Manufacturing Engineer to work with the Advanced Manufacturing Technology Group of a major Florida based Communications company. Support IR&D and Program activit
New Equipment | Fabrication Services
Minimum line width/space: 4mils Surface finish: immersion gold Board thickness: 1.60MM Minimum drilled hole diameter: 4mils Copper thickness: 0.5oz Special process : 0.25MM BGA , resin plugged vias in BGA pads
New Equipment | Solder Paste Stencils
Tropical Stencil’s Laser Cut SMT Stencils are produced utilizing high speed lasers to produce the smoothest aperture wall possible. Far superior to chemically etched stencils, and with emerging new materials, stencils are produced using “fine grain”
