Electronics Forum | Thu Dec 31 14:20:35 EST 1998 | Michael Allen
Kelvin, Yes, we're referencing the same spec. I performed the test under the Class 2 conditions (except that I used a 100V bias rather than 50V...but my water-washed microBGAs still passed). Regarding the omegameter test: we have this instrument,
Electronics Forum | Wed Oct 06 11:40:41 EDT 1999 | Debbie Alavezos
| | Hi, | | | | Help! Could anyone help to enlighten me on this? | | | | Question: | | | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z that using a n
Electronics Forum | Thu Feb 04 18:45:56 EST 1999 | Earl Moon
| Actually, solder paste adds about 12% to the joint volume for PBGAs, or about 31% for MicroBGAs -- assuming standard (recommended) pad sizes and stencil thicknesses, and paste with 90% metal content (50% metal by volume). Michael, In the "real wo
Electronics Forum | Tue Aug 22 21:00:39 EDT 2006 | davef
National says: [ http://www.national.com/packaging/llp/faq.html#faq_manu ] Manufacturing FAQ's Are there any precautions that need to be taken with the LLP package? It is critical to follow National�s guidelines for successful surface moun
Electronics Forum | Mon Jun 19 09:47:23 EDT 2017 | georgetruitt
You have a lot to think about! What does the flux manufacturer recommend as far as specifics like water temp or pressure? Do they recommend high temp di-water a detergent or saponifier? Do you currently have a cleaning machine, batch cleaner or inl
Electronics Forum | Tue Jan 05 20:29:32 EST 1999 | Steve Gregory
| A question for you all! | | Back in the good old days, we didn't always know how clean was clean. Much has changed. Much hasn't. | | My question concerns cleaning under, through, and around tight spaces. Way back when, we could not clean under 20
Electronics Forum | Wed Jan 06 09:55:22 EST 1999 | Chrys
| | A question for you all! | | | | Back in the good old days, we didn't always know how clean was clean. Much has changed. Much hasn't. | | | | My question concerns cleaning under, through, and around tight spaces. Way back when, we could not clea
Electronics Forum | Tue Oct 12 17:24:27 EDT 1999 | Kevin Ham
| | A question for you all! | | | | Back in the good old days, we didn't always know how clean was clean. Much has changed. Much hasn't. | | | | My question concerns cleaning under, through, and around tight spaces. Way back when, we could not clea
Electronics Forum | Wed Oct 06 03:58:25 EDT 1999 | Brian
| | Hi, | | | | Help! Could anyone help to enlighten me on this? | | | | Question: | | | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z that using a n
Electronics Forum | Wed Jan 06 04:51:16 EST 1999 | Earl Moon
| | A question for you all! | | | | Back in the good old days, we didn't always know how clean was clean. Much has changed. Much hasn't. | | | | My question concerns cleaning under, through, and around tight spaces. Way back when, we could not clea
