Electronics Forum | Thu Jun 29 09:29:46 EDT 2000 | JAX
sree, You might want to check the archives. If not, I found this just a few questions below yours!! [Back to thread listing at top] Posted by Igmar on June 22, 2000 at 10:27:26 AM EST Can someone please help with the aperture size on a Micro BGA st
Electronics Forum | Thu Dec 19 13:10:49 EST 2002 | gramsey
Really? Where does it say that? I have had the opposite experience and 3.2.2 from the IPC-7525 states for square or rectangular apertures - "Having a radiused corner for all apertures can promote stencil cleaning". It actually recommends circular ape
Electronics Forum | Wed Sep 01 11:09:45 EDT 2004 | burgosa
We are considering the CyberOptics SE300 for solder paste inspection at post-stencil print. Does anyone have experience with this AOI machine? How it works with small apertures like 0201's and uBGA's? Comments are welcome. Thanks
Electronics Forum | Wed Apr 27 12:26:49 EDT 2005 | jdumont
Square you say? Wouldnt this give less paste deposition than a circle and basically reduce the standoff height the same as making the pad bigger? Would using a type 4 paste for this size stencil aperture (.013") be a good idea? Thanks JD
Electronics Forum | Thu Sep 01 14:30:06 EDT 2005 | lsmith
I have recently tried electroform (100% nickel) stencils. Expensive but awesome paste release. 5 mil foil 10 - 15% aperture reduction for gasketing
Electronics Forum | Mon Apr 03 07:46:21 EDT 2006 | cyber_wolf
I have a pad layout that has .010" dia. with .010" spacing. Going to use a .004" foil. I know I need to over print them, but how much without causing bridging issues ? Thanks, Sr.
Electronics Forum | Tue Apr 04 14:00:48 EDT 2006 | russ
I have used a .013" square under these conditions. Limited run but all were good. 72 qty in 1 batch run
Electronics Forum | Wed Jan 12 03:39:00 EST 2011 | rpatel28364
Do you think it is because of too much solder. we have 5thou stencil and no reduction in aperture. Please reply
Electronics Forum | Thu Jul 01 13:57:57 EDT 1999 | Kris Wiederhold
| Dear guys, | | I have some problem on assembling micro-BGA with solder paste (63/37). The micro-BGA we assmeble is 0.75mm pitch and with 45 pin (solder bump is 96.5/3.5Ag). The stencil is a laser-cut stencil with 5 mil thickness. We are now usin
Electronics Forum | Tue Apr 26 18:23:30 EDT 2005 | russ
How does your machine recognize the part? Does it use vision for ball inspection or a just a body scan? What is the aperture size on the stencil? Have you calculated the area ratio? What is the aperture shape? What type of paste are you using? is
