Electronics Forum | Wed Jan 12 03:39:00 EST 2011 | rpatel28364
Do you think it is because of too much solder. we have 5thou stencil and no reduction in aperture. Please reply
Electronics Forum | Mon Apr 03 07:46:21 EDT 2006 | cyber_wolf
I have a pad layout that has .010" dia. with .010" spacing. Going to use a .004" foil. I know I need to over print them, but how much without causing bridging issues ? Thanks, Sr.
Electronics Forum | Thu Jul 01 13:57:57 EDT 1999 | Kris Wiederhold
| Dear guys, | | I have some problem on assembling micro-BGA with solder paste (63/37). The micro-BGA we assmeble is 0.75mm pitch and with 45 pin (solder bump is 96.5/3.5Ag). The stencil is a laser-cut stencil with 5 mil thickness. We are now usin
Electronics Forum | Tue Apr 26 18:23:30 EDT 2005 | russ
How does your machine recognize the part? Does it use vision for ball inspection or a just a body scan? What is the aperture size on the stencil? Have you calculated the area ratio? What is the aperture shape? What type of paste are you using? is
Electronics Forum | Thu Feb 23 18:05:53 EST 2006 | kennyg
What are some general guidelines for the minimum proximity of apertures to a stepdown on a stepped stencil. I have a step from 7 mils to 5 (one mil step each on the top and bottom). How far does the step need to extend beyond the apertures on the
Electronics Forum | Fri Sep 07 04:19:59 EDT 2018 | spoiltforchoice
You have lost me, its a stencil, you can change the aperture size, you can change the thickness and you can change the walls of the aperture. And all of those things will be in the papers anyone can find with a google. I have no clue what safe air g
Electronics Forum | Fri May 14 18:34:28 EDT 1999 | Earl Moon
| What is the best way to re-ball a BGA? Who has the best system for doing it? | I'm using our SRT rework stuff to reball in house - when necessary. Of course, we only do this for protos and test boards. We use a standard micro-stencil, after clean
Electronics Forum | Wed Nov 05 13:43:52 EST 2003 | swagner
I just did a bga job with square aperture's, the reasoning is for enhanced print release and additional paste volume. Be careful of the edge to edge clearance between the stencil openings, I don't recommend going below a 8 mil clearance, you could b
Electronics Forum | Thu Jan 15 10:08:54 EST 2004 | ADAM
Guys Does anyone have any design rules for a 121 pin BGA . The pitch is 0.031 thou, the ball diameter is 0.0115 thou . I would like to know the following : Pad and via sizes/type on the bareboard ? Stencil thickness and aperture size/sytle ? Solder
Electronics Forum | Tue Jul 31 10:41:49 EDT 2001 | ronho
I'm interested in process information from someone who has experience with this package, such as pad design, stencil aperture dimensions, stencil thickness, unique issues, profiling, solder paste. Design is considering this package for future produc
.png)
