Electronics Forum | Fri Apr 29 17:49:26 EDT 2005 | Woodsmt
I have used many of these devices recently and have used them several times over the last few years. I have been successful using a type 4 paste on a 5 mil stencil. The 13 mil round aperture should provide you with an area ratio just adequate for r
Electronics Forum | Wed Dec 14 08:08:42 EST 2005 | Champ Kind
Snaggletooth, I spent a good portion of my career fighting solder shorts on BGA's and QFP's, tombstones on 0402's, solderballs on passives, etc.. I've solved just about all those issues, and didn't solely rely on my stencil manufacturer... Your ste
Electronics Forum | Thu Jan 31 15:13:20 EST 2008 | chef
You will need to develop your reflow profile which includes drilling a hole through the fab and into the ball for accurate temp measure. During profile/process development you will probably want 3D x-ray (consider contracting that out). Once in prod
Electronics Forum | Mon May 07 16:07:05 EDT 2012 | davef
Start with targets based on the stencil thickness (for height) and stencil thickness times the aperture size (for volume). * Set reasonable upper and lower control limits (+ 25% and –25 % of the targets, for example). * Next, check the printer set-u
Electronics Forum | Fri Oct 18 07:14:51 EDT 2002 | cyber_wolf
Have you tried using a paste with a more aggressive flux? Our main paste is Indium, but whenever we run into oxidized parts or have soldering problems due to oxidation on pads we use an older Alpha WS paste called WS609. The drawback of this paste is
Electronics Forum | Mon Aug 14 12:08:35 EDT 2006 | cuculi54986@yahoo.com
I agree with using the homeplate design on chips. Some Pb-free solder paste manufacturers recommend 1:1 apertures. This, in my experience, is not a good idea with any of the SAC305 pastes I've tried. I've been using the same stencil design guideli
Electronics Forum | Thu Mar 29 14:55:59 EDT 2007 | HOSS
Hello, I searched the forums and found little specific info on LGAs with interior lands. This is not a QFN with a center pad. This is a multi-row BGA without solderballs. I'm looking for recommendations on PCB land to part land ratio, stencil a
Electronics Forum | Thu Mar 25 11:30:33 EDT 2010 | Sean
Hello Rajeshwara, If not mistaken, the 25% solder void specification is for BGA...As I I as know, no specification given to mosfet component yet..I think you are right, I need to look at the stencil aperture in order to reduce the air trap underneat
Electronics Forum | Sat Aug 21 12:38:09 EDT 1999 | Earl Moon
| Want to know the Tools/ Process required to get started with CSP prototyping and R & D. | Anyone working on this , please help out. | Depending on the type, size, and pitch - just like BGA's, they aren't tough. Our 1mm types went through prototypi
Electronics Forum | Tue Oct 09 20:27:13 EDT 2001 | davef
That�s a 672 BALL BGA, bud!!! It�s a BIG Mutha!!! [I know. I know. For some reason suppliers call balls "pins".] Let�s focus on: * Clarifying the units on your PCB and aluminum plate thickness measurements. * Describing your use of the aluminum pl
