Electronics Forum | Mon Dec 20 22:41:42 EST 2010 | grantp
Hi, We had it for a while, but had to take it out and replace it with normal convection. I mean the soldering quality is absolutely amazing, and the joints looked perfect, however it was a horror for tomb-stoning. We tried all types of stencil apert
Electronics Forum | Wed Jun 08 13:41:56 EDT 2011 | swag
Two thoughts from me: 1)Are you sure the balls are collapsed? Have you looked at the perimeter from the side with a scope? From your x-ray, it appears you are correct in saying they are collapsed as the balls get smaller in a uniform fashion as you
Electronics Forum | Mon Sep 24 12:58:31 EDT 2018 | vincentl
We are attaching 0.50mm diameter SAC 305 solder balls onto 0.38 diameter Au plated pins placed at a 0.80mm pitch (pins are pressed into a plastic insulator). A tacky flux is then stenciled onto the pins using a stencil with.a 0.38mm diameter aperture
Electronics Forum | Sat Jan 23 17:00:44 EST 1999 | Earl Moon
| | Hi Everyone, | | We plan to build, for reliability/experimental/research purpose some CSPs (namely Tessera microBGA 46-I/O 0/75mm pitch and TI 64 I/O 0/8 mm pitch). the various factors that we plan to evaluate are the reliability and assembly con
Electronics Forum | Thu Sep 02 12:01:49 EDT 1999 | stefano bolleri
| Could someone shares their experience on the causes of 'Open' in the BGA after reflow. | | Are you talking about "primary" process or rework? Are you sure you have not clogged apertures on your stencil? What is the pitch of the balls? My experie
Electronics Forum | Sat Aug 21 17:10:12 EDT 1999 | K. Vikas Sharma
| | Want to know the Tools/ Process required to get started with CSP prototyping and R & D. | | Anyone working on this , please help out. | | | Depending on the type, size, and pitch - just like BGA's, they aren't tough. Our 1mm types went through p
Electronics Forum | Wed Oct 02 09:36:10 EDT 2002 | scottefiske
Dragon, Was recently responsible for No Clean Process/Material evaluation and implementation project. Shop was 100% Water soluble facility. Several Top Paste manufacturers were invited to participate. (3) were evaluated. All key variables were identi
Electronics Forum | Tue Sep 19 13:09:48 EDT 2017 | slthomas
Thanks, all, for your responses. It's always helpful to know what everyone else is doing, whether to validate your own experience or to force you think in more detail. At this point we've determined that no amount of aperture design, material contr
Electronics Forum | Wed Sep 02 08:52:13 EDT 1998 | Justin Medernach
| | We are experiencing shorting on a BGA. The part has a 1mm pitch with a 196 I/O count. The problem seems to pop up without warning & disappear in the same manner. | | Our pad design is .020" diameter pads with .025" solder resist diameter. Th
Electronics Forum | Mon Apr 26 11:37:48 EDT 1999 | Chrys Shea
| | Hey Guys! | | | | Look what I get to try and do this week! I got handed a cardboard box on Friday afternoon with the parts and 20 of these little jewels! That's both sides of the board by the way... | | | | Whoever laid this out, I'd like to go
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