Electronics Forum | Fri Apr 11 06:22:04 EDT 2008 | andrzej
Hi Andrzej, > > We are using for BGA (0.8 pitch) > square apertures size 0.4 mm (rounded corners r = > t) and stencil thickness t=5 mils. So area > ration-_ w/4t=0.8 > > Regards Jan Hello Jan, I understand that you have the same pad dimensio
Electronics Forum | Fri Apr 11 05:51:20 EDT 2008 | janz
w/4t=0.8 Regards Jan
Electronics Forum | Wed Apr 16 02:46:55 EDT 2008 | andrzej
Thanks Jan for hints
Electronics Forum | Wed Feb 22 08:02:56 EST 2006 | dj44
I was looking for an stencil design for a 0.5mm pitch uBGA. Pad size is 0.38mm in diameter. We have been using 5mil stencil with type 3 no clean paste. What size aperture should we be using? Any suggestions?
Electronics Forum | Mon Apr 14 17:41:21 EDT 2008 | janz
Hello, That is working for us. If you have a look at the Indium or Cookson recommendation they are very similar. Just make few diffrent patterns of the BGA and find out what is workin for you. Regards Jan
Electronics Forum | Thu Feb 08 15:47:08 EST 2007 | realchunks
We use 1 to 1 aperture on a 6 mil stencil, no problems. Do not over print unless your board resist allows you too.
Electronics Forum | Wed Feb 22 10:00:58 EST 2006 | dougs
We've just set up a couple of products with 0.5mm pitch uBGA devices on them, i went for 5thou thick, laser cut nickel (to aid paste release) square pads same size as the diameter of the uBGA pads. Or you could go to a 4 thou nickel stencil, better
Electronics Forum | Thu Feb 08 08:28:11 EST 2007 | mzaboogie
Good Morning Everyone, We have an application coming up with several BGA's on a RoHS assembly. One is a 25 mil ball on a 40 mil pitch, another is a 15 mil ball on a 40 mil pitch. In the past for leaded assemblies, we have used square apertures for 1
Electronics Forum | Tue Feb 04 22:28:16 EST 2003 | davef
You could reduce the paste by about 70%. Solder balling and tombstoning will be the issues to fight. The drivers to these don't change with the component size. Use the fine SMTnet Archives for background. Aperture Size and Thickness of Solder Pas
Electronics Forum | Tue Feb 12 14:00:53 EST 2013 | dyoungquist
We have a board with a 1.0mm pitch BGA. The stencil apertures are 0.0177 inch diameter. We used an electroform stencil with good results.
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