Electronics Forum | Tue Mar 22 08:05:59 EST 2005 | jdumont
Morning all, my question is regarding the use of filled/tented/plugged vias on the BGA site. What are you guys doing for this? What type of issues can this cause if using none, or the improper via design. Regards, JD
Electronics Forum | Fri Jan 21 16:50:33 EST 2005 | Board House
I work for a board house and our proceedure for this process is the following, We cover the via pads leaving the hole open and then apply the surface finish and then go back and Cover the Via with a second operation. By doing this you do not entrap
Electronics Forum | Sun Jan 09 19:37:15 EST 2005 | Bob R.
I'm just thinking out loud here with no experience to back it up, but I could see where you're trapping air or solvent filled voids inside the via by tenting from both sides. When you go through a heat cycle like reflow or wave solder you could be e
Electronics Forum | Wed Feb 16 09:33:09 EST 2000 | Kurt Waskow
Interested in information regarding PCB soldermask tenting over vias within a BGA layout. Is this a common practice to reduce the occurrence of shorts, are there any reliability concerns? Thanks!
Electronics Forum | Mon Feb 21 08:33:53 EST 2000 | Tony Di Mauro
Kurt, When I was working in a captive manufacturing house we had been to migrate toward tenting all vias under the BGA to eliminate not only shorts but insufficient (Starved) joints. Tony
Electronics Forum | Wed Feb 16 09:33:09 EST 2000 | Kurt Waskow
Interested in information regarding PCB soldermask tenting over vias within a BGA layout. Is this a common practice to reduce the occurrence of shorts, are there any reliability concerns? Thanks!
Electronics Forum | Mon Feb 21 08:33:53 EST 2000 | Tony Di Mauro
Kurt, When I was working in a captive manufacturing house we had been to migrate toward tenting all vias under the BGA to eliminate not only shorts but insufficient (Starved) joints. Tony
Electronics Forum | Mon Feb 21 11:22:21 EST 2000 | K. Ckak
Hi Kurt, I agree with Dave F. I had exact same problem with PBGA placement. We requested our PCB vendor to plug/tent via (button printing) after HASL with SR1000 which worked well in the long run. There are couple of failure modes associated wit
Electronics Forum | Mon Feb 21 11:22:21 EST 2000 | K. Ckak
Hi Kurt, I agree with Dave F. I had exact same problem with PBGA placement. We requested our PCB vendor to plug/tent via (button printing) after HASL with SR1000 which worked well in the long run. There are couple of failure modes associated wit
Electronics Forum | Tue Feb 19 11:08:22 EST 2002 | Chris Anglin
Guideline for Tenting Interstitial BGA Vias It is difficult to give a complete recommendation on via tenting without an idea what process conditions are required (ex: wave pass, double reflow, rework etc.). Via Pads (as Test Points) - On Bottom
