Electronics Forum | Thu Jul 29 15:29:30 EDT 1999 | Earl Moon
| | | | | | | Presently protos of micro-bgas (80i/o) pitch .030/.031 | | | | | | | 12BGA per assembly | | | | | | | | | | | | | | The board is a (.062, 4 layers) FR-4 using Dry film | | | | | | | Pads .014inch | | | | | | | Vias within footprint .02
Electronics Forum | Tue Jul 27 16:44:31 EDT 1999 | Earl Moon
| | | Presently protos of micro-bgas (80i/o) pitch .030/.031 | | | 12BGA per assembly | | | | | | The board is a (.062, 4 layers) FR-4 using Dry film | | | Pads .014inch | | | Vias within footprint .020inch | | | Vias to be filled by bottom side(sol
Electronics Forum | Tue Jul 27 17:23:45 EDT 1999 | M.L
| | | | Presently protos of micro-bgas (80i/o) pitch .030/.031 | | | | 12BGA per assembly | | | | | | | | The board is a (.062, 4 layers) FR-4 using Dry film | | | | Pads .014inch | | | | Vias within footprint .020inch | | | | Vias to be filled by b
Electronics Forum | Mon Feb 19 22:56:20 EST 2007 | davef
Russ We agree with your comments on plugging from one side only. But... We believe that it IS possible to trap process chemicals [technically, not flux] in a blind [or any other] via. This can be done by plating the via closed, rather than pluggi
Electronics Forum | Tue Jul 15 16:12:23 EDT 2008 | boardhouse
Hi Armynski, I sell for an offshore board house, yes, it is common for offshore board shops to fill vias. The bubble is caused by air entrampment within the hole it self, when heat is applied during Hot air and the via is covered on both sides the e
Electronics Forum | Mon Sep 20 13:04:25 EDT 2004 | davef
The Intel BGA Developer�s Guide [ http://developer.intel.com/design/packtech/ch_14.pdf ] says: 14.8.3.3 Plated Through Hole (PTH) Isolation Regardless of the technique used for the mounting pads shape or definition, isolation of the plated through h
Electronics Forum | Thu Apr 15 10:05:50 EDT 2010 | dwonch
Hi all, Long story ahead.... We are having issues with board vendors on some of our higher layer count (thick) boards. Specifically under BGAs with high aspect ratio vias (14:1). We are using ENIG finish and a lead free process. Basically we get t
Electronics Forum | Tue Jul 27 17:54:37 EDT 1999 | Earl Moon
| | | | | Presently protos of micro-bgas (80i/o) pitch .030/.031 | | | | | 12BGA per assembly | | | | | | | | | | The board is a (.062, 4 layers) FR-4 using Dry film | | | | | Pads .014inch | | | | | Vias within footprint .020inch | | | | | Vias to
Electronics Forum | Tue Jun 05 03:56:52 EDT 2001 | JohnW
Flip Chip/uBGA Underfill Visual Standards The aim of this document is to produce some draft text and then select photographs to make up a draft visual standard for inspection. There is also a need to produce some reference material for C Scan image
