Full Site - : bga thermal parameter data (Page 11 of 26)

VJ Electronix to Exhibit PMT400 at Nepcon East 2008

Industry News | 2008-04-17 15:49:51.0

LITTLETON, MASS. - VJ Electronix, the leader in X-Ray inspection technology and Rework systems, announces that it will exhibit PMT400 Rework System in booth 725 at the upcoming Nepcon East exhibition and conference, scheduled to take place April 30-May 1, 2008 at the Boston Convention & Exhibition Center in Boston.

VJ Electronix

Indium Corporation's Dr. Lee, Dr. Liu, Keck and Page Recognized with Honorable Mention at IPC APEX EXPO

Industry News | 2014-03-27 11:31:00.0

Indium Corporation's Dr. Ning-Cheng Lee, vice president of technology, Dr. Yan Liu, research chemist, Joanna Keck, research technician and Erin Page, research technician, were awarded Honorable Mention for their paper Voiding and Drop Test Performance of Lead-Free Low-Melting and Medium-Melting Mixed Alloy BGA Assembly at the opening ceremony of the IPC APEX Expo on March 25.

Indium Corporation

MacDermid Alpha Presents Technical Paper at SMTA Penang Chapter

Industry News | 2022-09-15 06:27:38.0

The Assembly Division of MacDermid Alpha Electronics Solutions, a world leader in the production of electronics soldering and bonding materials, will present the technical paper: "Edge Bonding as Viable Reinforcement For Solder Joints in High Reliability Applications" at the SMTA Penang Chapter Expo & Technical Forum 2022 taking place from September 21 - 22 in Penang, Malaysia.

MacDermid Alpha Electronics Solutions

Innodisk Gives Sneak Peek of New Industrial Flash Products at Embedded World 2015

Industry News | 2015-02-06 02:51:52.0

New eMMC card, SATA Express and PCIe products as well as vertical market solutions will be displayed and demoed at annual embedded system trade fair

Innodisk Corporation

Indium Corporation Expert to Present at SiP Conference China

Industry News | 2022-04-28 14:14:09.0

Indium Corporation®'s Leo Hu, senior area technical manager – East China, will share the challenges and solutions of fine feature solder paste printing for system-in-package (SiP) at SiP Conference China, May 19, Shanghai, China.

Indium Corporation

Intelligently Linked: Approaching the Smart Factory with Communicating Machines

Industry News | 2017-10-16 20:23:07.0

SEHO Systems will focus on the complete networking of manufacturing lines at productronica, scheduled to take place Nov. 14 – 17, 2017 at the Messe München in Germany. Further highlights at the SEHO booth in hall A4, booth #578 will be presented from the field of wave soldering and reflow technology.

SEHO Systems GmbH

Hawk Electronics Purchases SP210avi Stencil Printer from Speedprint Technology

Industry News | 2010-10-14 15:49:36.0

Speedprint Technology Ltd. announces that Accrington-based CEM Hawk Electronics Ltd. has chosen its SP210avi stencil printer as its preferred machine.

Speedprint Technology

Isola Introduces Ultra-Low Loss Materials for Applications Over 100 Gbps

Industry News | 2014-02-05 10:37:27.0

Isola Group has begun alpha testing of Tachyon, its new ultra-low loss product that is engineered to reduce insertion loss on high-peed digital designs. It is specifically being targeted for high-layer count backplanes for the growing 100 gigabit per second (Gbps) market that has channel data rates in excess of 25 Gbps.

Isola Group


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