SMT Assembly line Auto BGA Rework Station Optical Alignment Demensions:L650×W630×H850mm SMT Assembly line Auto BGA Rework Station Optical Alignment PCB size:Max 400×390mm Applicable chips:Max 80×80mm Min 1×1 mm Pr
New Equipment | Rework & Repair Equipment
Different level BGA rework station and cusomized service provided, contact Rita Li for more information: whatsapp/wechat:0086 134 3448 1030 Email:sales11@zhuomao.com.cn Skype:ritaleeli ZM-R6823 BGA Rework System Stable and Uniform Hot Air He
New Equipment | Rework & Repair Equipment
Different level BGA rework station and cusomized service provided, contact Rita Li for more information: whatsapp/wechat:0086 134 3448 1030 Email:sales11@zhuomao.com.cn Skype:ritaleeli ZM-R6823 BGA Rework System Stable and Uniform Hot Air He
New Equipment | Rework & Repair Services
Specifications: 1.WDS-700 bga rework station 2.Optical alignment 3.Automatic machine 4.MCGS touch screen 5.CE,ISO passed 6.Small size Sole manufacturer WDS-700 automatic optical alignment mobile phone BGA rework station with HD camera Our
New Equipment | Rework & Repair Services
Specifications: 1.WDS-700 bga rework station 2.Optical alignment 3.Automatic machine 4.MCGS touch screen 5.CE,ISO passed 6.Small size Sole manufacturer WDS-700 automatic mobile phone BGA rework station for iphone / samsung /HTC motherboard wi
New Equipment | Rework & Repair Equipment
Cost Effective Rework of Medium Size Boards The FINEPLACER® coreplus is a compact, yet versatile rework system that offers a level of professionalism that exceeds its attractive price. The system offers proven rework technology for a wide spectrum
New Equipment | Rework & Repair Equipment
Silman BGA Rework Equipment BGA Rework Station 3 independent control heaters ① Top and bottom heaters are hot-air heating while the third IR heater is infrared heating. The top and bottom heaters can heat PCB from upper and bottom at the same tim
Technical Library | 2019-07-30 15:29:50.0
Area Array microelectronic packages with small pitch and large I/O counts are now widely used in microelectronics packaging. The impact of various package design and materials/process parameters on reliability has been studied through extensive literature review. Reliability of Ceramic Column Grid Array (CCGA) package assemblies has been evaluated using JPL thermal cycle test results (-50°/75°C, -55°/100°C, and -55°/125°C), as well as those reported by other investigators. A sensitivity analysis has been performed using the literature data to study the impact of design parameters and global/local stress conditions on assembly reliability. The applicability of various life-prediction models for CCGA design has been investigated by comparing model's predictions with the experimental thermal cycling data. Finite Element Method (FEM) analysis has been conducted to assess the state of the stress/strain in CCGA assembly under different thermal cycling, and to explain the different failure modes and locations observed in JPL test assemblies.
New Equipment | Rework & Repair Equipment
Factory Price Automatic Optical BGA Rework Station WDS-620 WhatsApp:+8615573072473 Skype:salesool-wisdomshow Business field Laptop and mother boards rework and repair. Game consoles applications rework and repair. Small and medium size elec
New Equipment | Rework & Repair Equipment
Updated system WDS-620 auto optical alignment system Mobile BGA rework station WhatsApp:+8615573072473 Skype:salesool-wisdomshow Business field Laptop and mother boards rework and repair. Game consoles applications rework and repair. Small
