Industry News | 2023-10-09 09:21:57.0
Indium Corporation is proud to count three of its experts amongst the presenters participating in the technical program at the upcoming IMAPS International Symposium on Microelectronics, October 3-5 in San Diego, California, U.S.
Industry News | 2015-03-23 12:27:07.0
Mentor Graphics Corporation (NASDAQ: MENT) today announced its new Xpedition® Package Integrator flow, the industry’s broadest solution for integrated circuit (IC), package, and printed circuit board (PCB) co-design and optimization. The Package Integrator solution automates planning, assembly and optimization of today’s complex multi-die packages. It incorporates a unique virtual die model concept for true IC-to-package co-optimization. In support of early marketing-level studies for a proposed new device, users can now plan, assemble and optimize complex systems with minimal source data. The new Package Integrator flow allows design teams to realize faster and more efficient physical path finding and seamless tool integration for rapid prototyping, right to the production flow.
Industry News | 2011-02-17 14:59:07.0
MARTIN will showcase its Mini-Oven 04 Reball/Prebump unit at the upcoming SMTA Dallas and Houston Expo & Tech Forums. The SMTA Dallas Expo & Tech Forum is scheduled to take place Tuesday, March 1, 2011 at the Richardson Civic Center in Richardson, TX and the SMTA Houston Expo & Tech Forum is scheduled to take place Thursday, March 3, 2011 at the Stafford Centre in Stafford, TX.
Industry News | 2011-09-19 16:30:56.0
MARTIN will showcase its Mini-Oven Reball/Prebump unit and Expert 10.6 rework system in Booth #407 at the upcoming SMTA International Conference & Exhibition.
Industry News | 2021-12-03 07:22:29.0
Clearwater, Florida: Productronica will be used as the launch pad for Solderstar's game-changing new datalogger, SLX. The innovative thermal profiler has been designed for operation with zero measurement setup, so it is instantly ready to use making the process of data capture quick and easy. As a leading supplier of temperature profiling equipment for reflow, wave, vapor and selective soldering, Solderstar will introduce the new product at their booth A4.240 during the exhibition held from 16-19 November, 2021 in Munich, Germany.
Industry News | 2010-07-16 16:08:56.0
Practical Components, a leading international distributor of mechanical IC samples or “dummy” components and SMD production tools and equipment, announces in-stock availability of the popular 15 mm PoP Thermal Cycling Board.
Industry News | 2023-09-25 19:19:56.0
Booth A4.246/4
PRO 1600 is a full forced air / nitrogen convection reflow oven that covers only 31" x 31" of floor space. It has been designed for reflow soldering of even the most challenging applications including, high thermal mass and lead free assemblies. PRO
PRO 1600-B is a benchtop full forced air convection reflow oven. It has been designed for reflow soldering of even the most challenging applications including, high thermal mass and lead free assemblies. PRO 1600-B is very flexible in terms of profil
Industry News | 2022-06-27 12:05:46.0
Solderstar, a leading specialist manufacturer in the design and development of thermal profiling equipment, is celebrating its 20th year in business. This month marks two successful decades of investment, growth, and commitment to offering the electronics manufacturing industry the most innovative equipment on the market.
