Industry News | 2022-03-25 12:40:21.0
Since launching at the end of last year, Solderstar's innovative new thermal profiler 'SLX' has gone from strength to strength thanks to its innovative new additions which will be showcased during SMTconnect Nuremberg from 10-12 May 2022 Hall 4 Stand 226.
Industry News | 2022-03-25 12:40:48.0
Since launching at the end of last year, Solderstar's innovative new thermal profiler 'SLX' has gone from strength to strength thanks to its innovative new additions which will be showcased during SMTconnect Nuremberg from 10-12 May 2022 Hall 4 Stand 226.
Industry News | 2015-03-23 12:27:07.0
Mentor Graphics Corporation (NASDAQ: MENT) today announced its new Xpedition® Package Integrator flow, the industry’s broadest solution for integrated circuit (IC), package, and printed circuit board (PCB) co-design and optimization. The Package Integrator solution automates planning, assembly and optimization of today’s complex multi-die packages. It incorporates a unique virtual die model concept for true IC-to-package co-optimization. In support of early marketing-level studies for a proposed new device, users can now plan, assemble and optimize complex systems with minimal source data. The new Package Integrator flow allows design teams to realize faster and more efficient physical path finding and seamless tool integration for rapid prototyping, right to the production flow.
Ideal for in-house Rapid PCB Prototyping The ProtoFlow S is LPKF's premiere convection oven, ideal for lead-free reflow soldering, meeting the stringent demands of rapid PCB soldering applications. The ProtoFlow S features even heat distribution, e
New Equipment | Assembly Services
introduction: ZH series is a fully automatic SMT placement machine, it can be mounted various of component through a vacuum nozzle, it is currently on the market cost-effective automatic placement equipment. The machine is suitable for most of the
Industry News | 2011-02-17 14:59:07.0
MARTIN will showcase its Mini-Oven 04 Reball/Prebump unit at the upcoming SMTA Dallas and Houston Expo & Tech Forums. The SMTA Dallas Expo & Tech Forum is scheduled to take place Tuesday, March 1, 2011 at the Richardson Civic Center in Richardson, TX and the SMTA Houston Expo & Tech Forum is scheduled to take place Thursday, March 3, 2011 at the Stafford Centre in Stafford, TX.
Industry News | 2011-09-19 16:30:56.0
MARTIN will showcase its Mini-Oven Reball/Prebump unit and Expert 10.6 rework system in Booth #407 at the upcoming SMTA International Conference & Exhibition.
Industry News | 2021-12-03 07:22:29.0
Clearwater, Florida: Productronica will be used as the launch pad for Solderstar's game-changing new datalogger, SLX. The innovative thermal profiler has been designed for operation with zero measurement setup, so it is instantly ready to use making the process of data capture quick and easy. As a leading supplier of temperature profiling equipment for reflow, wave, vapor and selective soldering, Solderstar will introduce the new product at their booth A4.240 during the exhibition held from 16-19 November, 2021 in Munich, Germany.
Overview of PRO 1600 Forced Convection Reflow Oven in operation. Features include small footprint (31" x 31"), lead free reflow capable, and precise software process control.
Overview of PRO 1600 Forced Convection Reflow Oven in operation. Features include small footprint (31" x 31"), lead free reflow capable, and precise software process control.
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