Technical Library | 2023-01-17 17:22:28.0
The impact of voiding on the solder joint integrity of ball grid arrays (BGAs)/chip scale packages (CSPs) can be a topic of lengthy and energetic discussion. Detailed industry investigations have shown that voids have little effect on solder joint integrity unless they fall into specific location/geometry configurations. These investigations have focused on thermal cycle testing at 0°C-100°C, which is typically used to evaluate commercial electronic products. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC- 9701 specification for tin/lead solder alloys. This temperature range is more typical of military and other high performance product use environments. A proposed BGA void requirement revision for the IPC-JSTD-001 specification will be extracted from the results analysis.
Industry News | 2012-01-23 00:02:12.0
MIRTEC, “The Global Leader in Inspection Technology”, will premier its complete line of 3D AOI, SPI, X-ray and LED inspection systems at the IPC APEX Expo in booth #3637.
Industry News | 2017-01-11 18:22:38.0
MIRTEC, “The Global Leader in Inspection Technology,” will premier its complete line of 3D AOI and SPI Inspection Systems in Booth #3101 at the 2017 IPC APEX EXPO. The premier technical conference and exhibition for the electronics manufacturing industry will take place Feb. 14-16, 2017 at the San Diego Convention Center.
Industry News | 2016-02-17 17:07:17.0
“The Global Leader in Inspection Technology,” will premier its complete line of 3D AOI and SPI Inspection Systems in Booth #1334 at the 2016 IPC APEX EXPO. The premier technical conference and exhibition for the electronics manufacturing industry will take place March 15-17, 2016 at the Las Vegas Convention Center.
Industry News | 2015-01-21 21:05:20.0
MIRTEC, “The Global Leader in Inspection Technology,” will premier its complete line of 3D AOI and SPI Inspection Systems in Booth #2333 at the 2015 IPC APEX EXPO. The premier technical conference and exhibition for the electronics manufacturing industry will take place Feb. 24–26, 2015 at the San Diego Convention Center.
Industry News | 2014-02-17 20:17:14.0
MIRTEC, “The Global Leader in Inspection Technology”, will premier its complete line of 3D AOI, and SPI Inspection Systems at IPC APEX 2014 booth #2263.
Used SMT Equipment | SMT Equipment
Product name: KE - 3010 A high-speed chip mounter Product number: KE – 3010A Detailed product introduction Characteristic： Constantly improve the KE series products. So as to realize the high speed high quality electric production line of flexib
Used SMT Equipment | Pick and Place/Feeders
Product name: KE - 3010 A JUKI high-speed chipmounter Product number: KE – 3010A Detailedproduct introduction Characteristic： Constantly improve the KE series products. So as to realize the high speed highquality electric production
Used SMT Equipment | Pick and Place/Feeders
Product number: KE - 3020VA/ VRA Detailed product introduction Constantly improve the KE series products. So as to realize the high speed highquality electric production line of flexible structure. Chip components 20900 CPH chip (laser identific
Used SMT Equipment | Pick and Place/Feeders
Yamaha YV88XG SMT Machine Specification (Note: Multifunctional machine, two working heads, two nozzle heads) Placement speed 0.55s /CHIP(* best condition); 0.9s /QFP(□31mm, 0.5mm spacing)
IPC is the trade association for the printed wiring board and electronics assembly industries.
Training Provider / Events Organizer / Association / Non-Profit
3000 Lakeside Drive, 309 S
Bannockburn, IL USA
Phone: 847-615-7100
.gif)
.png)
