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Full Hot Air Lead-Free Reflow Oven With PC Temp Control System (A800) Introduce: 1, Heating system adopts ETA patent heating technology 2, The use of imported large current solid state relay contact output, safe, reliable, equipped with a dedicated
Electronics Forum | Mon Aug 19 16:57:38 EDT 2002 | dragonslayr
Individual process steps are approximately the same length of time for reworking a BGA. You seem to be comparing the use of the automated SMT line versus an off line rework station. Consider that the off line station is a complete paste print, pick
Electronics Forum | Sat May 12 00:04:36 EDT 2001 | zam_bri
The product I'm running currently consist a mix of 20 mil pitch QFP, 50 mil pitch, 0402, BGA and variable size of connectors from small to big, on OSP finished PCB. Running intrusive reflow with a mix packages is a real headache, esplly when you hav
Industry News | 2018-10-18 10:24:05.0
The Design Principles of Stencil Apertures
Industry News | 2018-10-18 08:59:34.0
PRINCIPLE OF SURFACE MOUNT PROCESS(SMT PROCESS)
ETA SMT Reflow Oven with 8 Heating Zones S8 PCB Ovens ❙ Introduce of Reflow Soldering Oven ETA advanced reflow oven, reflow soldering, reflow soldering oven, SMT reflow oven technology | 25 years SMT technology experience | professi
Hot Air SMD LED PCB Reflow Soldering Oven Machine SMT Oven with CE Certificate ❙ Introduce of Reflow Soldering Oven ETA advanced reflow oven, reflow soldering, reflow soldering oven, SMT reflow oven technology | 25 years SMT technol
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
length and resulted in a loss of solder joint integrity. This BGA solder joint was located on the outer row but not a corner location. Figure 25 and Figure 26 illustrate a solder joint failure due to a 31.3% void reducing the crack path length. This BGA
| https://www.eptac.com/soldertip/soldertips-printed-circuit-board-bow-and-twist-showing-up/
: We have recently started to see board flexing in one of our circuit board assemblies. This assembly has a 40mm PoP BGA component on it with an integrated heat sink
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