Electronics Forum | Tue Aug 10 09:09:39 EDT 2004 | mattkehoe
wash->ssd top->wash->sticky flux bottom side->place smt components->reflow->wash->sticky flux top side->place topside smt components->reflow->wash) ssd is basically the process of applying solder paste to the pcb with a stencil and the solder reflowe
Electronics Forum | Tue Oct 05 04:01:36 EDT 1999 | Brian
| Hi, | | Help! Could anyone help to enlighten me on this? | | Question: | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z that using a normal water cl
Electronics Forum | Mon Apr 26 11:37:48 EDT 1999 | Chrys Shea
| | Hey Guys! | | | | Look what I get to try and do this week! I got handed a cardboard box on Friday afternoon with the parts and 20 of these little jewels! That's both sides of the board by the way... | | | | Whoever laid this out, I'd like to go
Electronics Forum | Mon Apr 26 16:24:35 EDT 1999 | JohnW
| | | Hey Guys! | | | | | | Look what I get to try and do this week! I got handed a cardboard box on Friday afternoon with the parts and 20 of these little jewels! That's both sides of the board by the way... | | | | | | Whoever laid this out, I'd
Electronics Forum | Mon Apr 26 22:40:27 EDT 1999 | Dean
| | | | Hey Guys! | | | | | | | | Look what I get to try and do this week! I got handed a cardboard box on Friday afternoon with the parts and 20 of these little jewels! That's both sides of the board by the way... | | | | | | | | Whoever laid this
Electronics Forum | Sat Mar 29 08:38:28 EST 2003 | davef
Iman When you talk about your profile, can we assume you're measuring it on the pads of LGA? Profile the solder paste reflow by placing a thermal couple under the component pad, similar to a BGA. On a slight tangent, as with soldering BGA, paste
Electronics Forum | Sat Jun 05 13:38:22 EDT 2021 | ppcbs
For Linear Tech LGA's we solder bump the LGA using a .30mm solder ball then reflow with a tacky flux. This will provide a void free solder joint and adds a little height to the solder joint in case you use a flux that you want to clean from under th
Electronics Forum | Mon Aug 17 02:50:44 EDT 1998 | Bob Willis
| Have an SRT w/preheat, 18 layer board all copper, 456 BGA needs to be removed and replaced. The manufacturer is Chip Express and during reflow it warps up or down. Causing either opens or shorts on the corners. I was using gel flux with multiple
Electronics Forum | Sat May 16 19:31:27 EDT 1998 | Graham Naisbitt
Gentlemen, Please consider that ionic testing is designed only for detecting ionic contaminants. Yes there are instances of non-ionic contaminants that cause premature circuit failure. However, more importantly the prevailing specs are less than adeq
Electronics Forum | Fri Jan 03 12:12:22 EST 2003 | richard
Good day and thanks for your comments Mike, What did I understood from your notes� 1) ROSE test (�extracting solution�) is probably good enough (with good equipment) to penetrate the space under my micro BGA. 2) I should test 2 parallel batches of
