Full Site - : bga washing (Page 12 of 18)

SMT Assembly Line

Electronics Forum | Mon May 29 04:02:51 EDT 2006 | vasily

Hi Efren Unfortunately I cannot say about prices, because I don't know them in your region. But I can offer you to consider the world-leader manufacturers of each type of equipment. I think you can obtain all information through their web-sites. We s

Need help for setting up an assembly line

Electronics Forum | Mon Jun 19 22:19:40 EDT 2006 | Nathan

Dear All, We plan to setup an assembly line for our small volume production of PCBs (about couple hundred PCBs per week). The board has about 150 components (less than 30 types) and a few BGA and IC (majority is SMT, only few THT connectors). We hav

What is the best way to remove OSP coatings.

Electronics Forum | Tue Sep 11 22:52:18 EDT 2007 | davef

Here are some options for removing OSP coatings from pads of the BGA substrates. * Leave the substrates in storage for 13-14 months. Shelf life of OSP coating is ~12 months, depending on the product. * Wash the substrates in your aqueous washer. Ea

Humiseal 1A33 conformal coating using automated atomized spray

Electronics Forum | Tue Jul 03 01:54:42 EDT 2018 | rdhiman1

Reaching out to all conformal coating experts, please help! While setting up conformal coating using the automated atomized spray, we observing issues associated with conformal coating wetting on the following regions: 1) Component edges 2) Metalli

Water wash flux and cleaning

Electronics Forum | Mon Jun 19 09:47:23 EDT 2017 | georgetruitt

You have a lot to think about! What does the flux manufacturer recommend as far as specifics like water temp or pressure? Do they recommend high temp di-water a detergent or saponifier? Do you currently have a cleaning machine, batch cleaner or inl

Re: CSP Assembly- SIR Test

Electronics Forum | Thu Dec 31 14:20:35 EST 1998 | Michael Allen

Kelvin, Yes, we're referencing the same spec. I performed the test under the Class 2 conditions (except that I used a 100V bias rather than 50V...but my water-washed microBGAs still passed). Regarding the omegameter test: we have this instrument,

uBGA (.5mm pitch) printing woes

Electronics Forum | Tue Sep 19 09:41:30 EDT 2017 | sumote

Steve, The 4 things I would do, and in this order: 1. Clean your stencil with stencil cleaner wipes after it comes out of the stencil cleaner. I like MicroCare ProClean (MCC-PROWR). I will even saturate the wipe with a bit of isopropal just till

Re: CSP Assembly- No-clean vs Aqueous

Electronics Forum | Tue Dec 29 22:31:06 EST 1998 | Kelvin Chow

It is still a big concern on using No-clean or aqueous cleaning for CSP assembly. I prefer to use no-clean, however, not all components are suitable to use it. Especially those dirty capacitors or connectors which may cause solderability problem. It

Re: CSP Assembly- No-clean vs Aqueous

Electronics Forum | Wed Dec 30 17:34:23 EST 1998 | Michael Allen

I'm afraid we don't agree regarding the best test method to use here. My understanding is as follows. The omegameter test measures board-level, ionic contamination (i.e., average for the entire board area and all components); it does not tell you w

BCC Technology --- Placement, Rework, Reflow

Electronics Forum | Thu Apr 04 05:33:19 EST 2002 | ianchan

Hi, hope this helps : 1) BCC (bump chip carrier) production for us, was with a 5mils Stencil. The outer perimeter smallish pads are not much of a problems. For the central large pad, we split the paste print (corresponds to the Stencil apperture op


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