Electronics Forum | Fri Oct 08 17:03:03 EDT 1999 | Dave F
| Hi, | | Help! Could anyone help to enlighten me on this? | | Question: | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z that using a normal water cl
Electronics Forum | Wed Oct 06 11:40:41 EDT 1999 | Debbie Alavezos
| | Hi, | | | | Help! Could anyone help to enlighten me on this? | | | | Question: | | | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z that using a n
Electronics Forum | Tue Aug 03 18:11:21 EDT 2004 | davef
Improper washing of water soluable flux residues can be a major contributor to flux residues remaining on the board surface. ;-O That you appear to be only complaining about the pathetic state of the ability of your washer to clean under BGA, it may
Electronics Forum | Tue Oct 05 14:38:06 EDT 1999 | Debbie Alavezos
| | Hi, | | | | Help! Could anyone help to enlighten me on this? | | | | Question: | | | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z that using a n
Electronics Forum | Thu Sep 14 13:13:29 EDT 2006 | Kevin W. Parker
I am a tool and process engineer responsible for the cleaning system at Siemens VDO in Huntsville, AL. I have been over this area for more than 8 years. We use EMC Cyberclean 3000RF spray in air cleaners with Zestron SC202 chemistry. At this facil
Electronics Forum | Tue Sep 25 13:01:48 EDT 2001 | Hussman
If the flux you are applying by brush is alcohol based, use some alcohol on a few failed PCBs and retest. It souldn't take a lot of flux to reflow the balls to a pad that's already covered with solder and flux from the first BGA - unless you are cle
Electronics Forum | Thu Nov 22 12:56:12 EST 2001 | tony_sauve
Thanks for the comments & suggestions. Here's some info garnered from a telecon w/the PCB Fab house: -the blind via's extend from layer 2-17...this was a revelation. The info from our customer was that the via's only extended down 2 layers. Did I men
Electronics Forum | Mon May 07 16:07:05 EDT 2012 | davef
Start with targets based on the stencil thickness (for height) and stencil thickness times the aperture size (for volume). * Set reasonable upper and lower control limits (+ 25% and –25 % of the targets, for example). * Next, check the printer set-u
Electronics Forum | Tue Aug 21 21:39:19 EDT 2001 | davef
1) why is No-clean (NC) the preferred process, for BGA mounting by SMT? Probably the same reason NC is the preferred process for mounting non-area array SMT components. 2) why is water-soluble (WS) not a hot choice? There�s not reason not to use
Electronics Forum | Tue Oct 05 06:03:37 EDT 1999 | Graham Naisbitt
| Hi, | | Help! Could anyone help to enlighten me on this? | | Question: | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z that using a normal water cl
