Electronics Forum | Wed Oct 06 00:26:04 EDT 1999 | Karlin
| Hi, | | Help! Could anyone help to enlighten me on this? | | Question: | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z that using a normal water cl
Electronics Forum | Wed Oct 06 08:41:42 EDT 1999 | Dave F
| | Hi, | | | | Help! Could anyone help to enlighten me on this? | | | | Question: | | | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z that using a n
Electronics Forum | Sat Oct 29 20:29:30 EDT 2016 | adamjs
Posting here because all the threads asking for feedback on it are locked. We have been extremely happy with the 4300 tacky flux for BGA attachment. Not only is it both washable and no-clean (i.e. wash-optional), it was also the only tacky flux tha
Electronics Forum | Thu Jul 14 01:43:09 EDT 2005 | pyramus
Solder paste used was Kester FL250M (no-clean).... components affected were only chip components 0603, no BGA & no IC components.
Electronics Forum | Fri Aug 28 14:00:21 EDT 2009 | kennyg
O.M.G. ! Its blue pad ! ...RE: O.M.G. ! Its blue pad !... or blue balls, assuming there are BGA's on the assembly
Electronics Forum | Thu Mar 25 12:20:21 EST 2004 | Mike Konrad
OK� Nap time�s over! Technically speaking, water soluble flux is just that, soluble in water. Technically speaking, one does not need a saponifier or any other chemical agent to remove water soluble (OA) flux residues. However, one must conside
Electronics Forum | Wed Oct 06 12:03:12 EDT 1999 | Graham Naisbitt
| | Hi, | | | | Help! Could anyone help to enlighten me on this? | | | | Question: | | | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z that using a n
Electronics Forum | Fri Oct 08 02:31:07 EDT 1999 | Brian
| | | | Hi, | | | | | | | | Help! Could anyone help to enlighten me on this? | | | | | | | | Question: | | | | | | | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowab
Electronics Forum | Mon Oct 05 14:38:03 EDT 2015 | deanm
We are planning on using a chip that is available in LGA or Sn/Pb balled BGA. The package dimensions are the same. Pitch = 1.27mm. We are using a Sn/Pb soldering process and no clean paste (wash afterward) for high reliability Class 3 assemblies. Fai
Electronics Forum | Thu Feb 27 15:33:37 EST 2003 | James
We need to use water-soluble paste due to cleanliness requirements. No-clean does not mean No-contamination. I have talked to a lot of people who use no-clean and they still wash their boards except now they have to use chemicals to do it. So, you
