Electronics Forum | Wed Oct 06 03:58:25 EDT 1999 | Brian
| | Hi, | | | | Help! Could anyone help to enlighten me on this? | | | | Question: | | | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z that using a n
Electronics Forum | Wed Jun 30 18:02:53 EDT 1999 | Mark
| What is the best way to re-ball a BGA? Who has the best system for doing it? | To RE-Ball an IC you must re-BALL the IC! The idea of using a stencil to deposit all of the appropriate solder mass can not work. Here is the process (minus the app
Electronics Forum | Tue Dec 29 11:40:24 EST 1998 | Michael Allen
I don't have answers...just comments. We're just starting to assemble CSPs on protos, and I've got the same concerns you have. The MicroBGA package I'm working with has a ball diameter of 0.325mm (0.0128") and a standoff of just 0.010" BEFORE solde
Electronics Forum | Fri Feb 25 14:34:44 EST 2000 | Ioan
Larry, the best paste thinner is the one that your paste supplier recommends. You should check with him. We have no problems removing the no-clean paste with alcohol. If you want to give it a try, make sure you use IP alcohol, not alcohol based flux
Electronics Forum | Fri Feb 25 14:34:44 EST 2000 | Ioan
Larry, the best paste thinner is the one that your paste supplier recommends. You should check with him. We have no problems removing the no-clean paste with alcohol. If you want to give it a try, make sure you use IP alcohol, not alcohol based flux
Electronics Forum | Thu Apr 11 19:06:59 EDT 2002 | tmarc
We are using 1mm pitch BGAs with a great quantity of via(s) under the component. Very shortly we will be placing CSPs with .65mm pitch. Our via(s) are solder masked, however we generally have a percentage of them that the masking is thin enough that
Electronics Forum | Thu Jan 29 14:24:56 EST 2004 | rick
What kind of cleaning method you recommend for PCB - double side SMD (fine pitch and BGA components) and THT elements (PCB are for microwave application!!). Process technology no-clean.We have to remove grease-fingerprints, dust etc. It is low volume
Electronics Forum | Wed Oct 20 07:09:12 EDT 2004 | mattkehoe
Not really. Our process is a solid solder deposition application so we are not placing components into the wet paste prior to reflow. We print the paste then reflow is without components, trying to create a meniscus which is then washed, flattened,
Electronics Forum | Thu May 05 12:31:27 EDT 2005 | russ
Not in this case, these BGAs were lead free and the profile used was for a lead part. I guess I will give you the whole story. These boards were sent to us from a customer to have the BGAs replaced for an unknown to us reason. We removed the parts
Electronics Forum | Tue Feb 07 11:55:27 EST 2023 | tommy_magyar
What I would look at is the chemicals being used in the facility where the complaints are. Flux/flux gel, IPA, cleaning agents, etc. Perhaps you should limit the usage to certain people only, who would be trained how to properly use these. Something
