Full Site - : bga water soluble (Page 10 of 133)

PF606-P245 Lead-free Solder Paste Offers Continuous High-Speed Printability

Industry News | 2018-07-02 21:54:56.0

SHENMAO America, Inc. is pleased to introduce the PF606-P245 New Generation Lead-free Zero Halogen Solder Paste. The paste provides continuous high-speed printability that produces superior solder paste print quality as well as a wide reflow process window for excellent solderability.

Shenmao Technology Inc.

Cobar to Exhibit Water-Soluble LF3237 Solder Wire at SMTA Upper Midwest

Industry News | 2013-06-06 19:12:21.0

The Balver Zinn Group announces that Cobar Solder Products Inc. will exhibit Balver Zinn water-soluble LF3237 Solder Wire in Booth #44 at the upcoming SMTA Upper Midwest Expo and Tech Forum, scheduled to take place Thursday, June 27, 2013 at the Embassy Suites in Bloomington, MN

Cobar Solder Products Inc.

AQUANOX® A4638 Advanced Packaging Cleaning Chemistry

AQUANOX® A4638 Advanced Packaging Cleaning Chemistry

New Equipment | Cleaning Agents

Advanced Packaging Cleaning Chemistry AQUANOX® A4638 is an engineered electronic assembly and advanced packaging cleaning agent designed to remove flux residue from flip chip and low clearance components. AQUANOX® A4638 is designed to remove water s

KYZEN Corporation

FCT Assembly Premiers WS159 Tin-Lead Water-Soluble Solder Paste

Industry News | 2009-05-18 17:19:51.0

GREELEY, CO - FCT Assembly debuts WS159 water-soluble solder paste, featuring FCT's latest technology in print and reflow of paste in the water soluble category.

FCT ASSEMBLY, INC.

Basic red 1

Basic red 1

New Equipment | Materials

Basic red 1 Synonyms: C. I. 45160; Rhodamine 6G; Rhodamine 6GDN CAS Number: 989-38-8 Molecular Formula: C28H31N2O3. Cl Water solubility SOLUBLE Appearance: Red brown powder Main Application: Pigment red 81, lake, paint etc. Packing: 25KG/Drum M

Cangzhou Goldlion Chemicals Co.,Ltd

Pillar Flip Chip Applications at SEMICON West

Industry News | 2016-06-22 16:15:35.0

KYZEN today announced plans to exhibit in Booth #305 at SEMICON West, scheduled to take place July 12-14, 2016 at the Moscone Center in San Francisco, CA. KYZEN will exhibit MICRONOX® MX2302 for wafer bumping, Ionox® FCR for wire bonding and MICRONOX® 2707 for Cu pillar flip chip applications.

KYZEN Corporation

We've Got You Covered // ZESTRON Contract Cleaning

We've Got You Covered // ZESTRON Contract Cleaning

Videos

ZESTRON is proud to offer PCB contract cleaning and analytical services at our Technical Center located in Manassas Virginia. Have you purchased new cleaning machinery and require PCB cleaning services during the interim? Have you won a new contract

ZESTRON Americas

MacDermid Alpha Electronics Solutions Launches ALPHA WS-826 Robust Water Soluble Solder Paste

Industry News | 2021-10-07 15:45:29.0

MacDermid Alpha Electronics Solutions announces the release of ALPHA WS-826 water soluble solder paste, designed to provide excellent environmental stability even in extreme operating conditions.

MacDermid Alpha Electronics Solutions

Water Soluble and No-Clean Fluxes

Water Soluble and No-Clean Fluxes

New Equipment | Solder Materials

We offer a full line of Water Soluble Fluxes and No-Clean Flux for SMT, IC packaging and PCB Wave solder applications.  We provide halide-containing and halide-free fluxes for Lead-Free solder alloys. Besides, our Lead-Free Liquid Fluxes have been a

Shenmao Technology Inc.

SHENMAO Awarded for Lead & Halogen-Free Solder Wire

Industry News | 2020-10-27 12:41:51.0

SHENMAO America, Inc. received a 2020 Mexico Technology Awardin the category of Solder – Bar & Wire for its PF606-F13 lead-free and halogen-free solder wire.The award was announced during a Virtual Awards Ceremony on Monday, October 26, 2020.

Shenmao Technology Inc.


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